Packaging Module Equipment Development Engineer

Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability. Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement. Documents technical findings, process improvements, and best practices through technical reports and white papers. Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities. Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are achieved. Supports innovation efforts focused on process reliability, manufacturing quality, and equipment efficiency. Leads technical problem-solving and process improvement initiatives using experimental design and statistical analysis methods. Provides technical consultation related to packaging and manufacturing process improvements and responds to customer or stakeholder needs as required. Partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and technology readiness aligned to product milestones and key risk areas. Our metrology technologies are rapidly evolving toward advanced Artificial Intelligence (AI) and Machine Learning (ML) applications used to process equipment-generated 2D and 3D images from digital camera and ultrasound inspection systems. Current and future Metrology Engineers are expected to develop strong technical capabilities in the following areas: Operating, programming, troubleshooting, and optimizing automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors. Utilizing software tools to process and analyze inspection images, optimize algorithms and defect detection limits, run iterative analyses, and collaborate with AI experts and automation teams to improve true-defect detection while minimizing false positives and reducing manual operator review. Performing data analysis to identify patterns, understand input/output relationships, and continuously improve inspection system performance and process capability. Partnering with suppliers and cross-functional engineering teams to develop next-generation inspection and metrology technologies capable of detecting new failure modes in future products and materials. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Bachelor’s degree in Engineering, Physics, Chemistry, Materials Science, or a related technical field with 5+ years of engineering industry experience including inspection equipment; OR Master’s degree in a related field with 3+ years of engineering industry experience; OR PhD in a related field with 6+ months of engineering industry experience. Preferred Qualifications: Experience with automated inspection tools, image processing algorithms and artificial intelligence. Semiconductor fabrication processes and technology experience. Advanced packaging and/or assembly process experience. Experience with equipment selection, integration, ownership, and change control management systems. Project management experience delivering results for complex, time-critical technical projects. Strong technical problem-solving and innovation skills within manufacturing or engineering environments. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology. 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