Manufacturing Engineer I

Position Summary The Manufacturing Engineer I is responsible for developing, maintaining, and improving manufacturing processes for circuit card assemblies (CCAs) and electronic assemblies utilizing Surface Mount Technology (SMT) and Through-Hole (TH) processes. This role focuses on optimizing quality, efficiency, and throughput by applying systematic problem‑solving techniques, supporting production operations, and driving continuous improvement initiatives. The Manufacturing Engineer I ensures manufacturing processes are robust, repeatable, and compliant with customer, industry, and quality requirements to support high‑quality products, on‑time delivery, and cost‑effective operations. Essential Duties and Responsibilities Interpret customer drawings, specifications, engineering documentation, quality requirements, and engineering change notices (ECNs/ECOs). Develop, maintain, and improve manufacturing processes to ensure compliance with customer, regulatory, and internal requirements. Create and revise operator work instructions for both automated and manual assembly processes, including quality checkpoints and inspection criteria. Design, specify, procure, validate, and maintain manufacturing tooling, including: SMT stencils Wave solder pallets Press‑fit tooling Component preparation and forming tools Jigs, fixtures, and assembly aids Develop and maintain SMT reflow and through‑hole soldering profiles to ensure product quality and process consistency. Maintain and support customer Bills of Materials (BOMs) within applicable systems. Manage chemical approval processes and support proper application of manufacturing materials and consumables. Monitor and control process parameters to ensure products consistently meet IPC‑A‑610 and J‑STD‑001 Class 3 workmanship and quality standards. Support new product introductions (NPI), product launches, and engineering transfers to validate process effectiveness and implement improvements as needed. Collaborate with production teams to identify, troubleshoot, and resolve manufacturing issues related to manpower, methods, machines, materials, measurements, and environmental factors. Utilize root cause analysis and corrective action methodologies to address process, quality, and production challenges. Monitor manufacturing performance metrics and identify opportunities to improve yield, quality, throughput, and efficiency. Drive continuous improvement initiatives focused on reducing waste, minimizing downtime, improving process capability, and lowering manufacturing costs. Support line balancing, capacity planning, and changeover reduction efforts to optimize production flow. Collaborate effectively with Quality, Production, Supply Chain, Engineering, and other cross‑functional teams to achieve business objectives. Maintain accurate process documentation and engineering records. Adhere to all safety, environmental, health, and regulatory requirements. Comply with all company policies, procedures, and security requirements. Perform other duties and responsibilities as assigned. Qualifications Required Knowledge, Skills, and Abilities Knowledge of manufacturing engineering principles, process development, and continuous improvement methodologies. Understanding of SMT and Through‑Hole assembly processes for electronic manufacturing. Familiarity with IPC‑A‑610 and J‑STD‑001 standards; Class 3 experience preferred. Strong analytical and problem‑solving skills with the ability to perform root cause analysis and implement corrective actions. Ability to interpret engineering drawings, specifications, schematics, and technical documentation. Experience developing manufacturing documentation, work instructions, and process controls. Effective verbal and written communication skills with the ability to collaborate across multiple departments. Strong organizational skills and attention to detail. Proficiency with Microsoft Office applications, including Excel, Word, and PowerPoint. Experience with ERP/MRP systems and manufacturing software preferred. Education and Experience Bachelor's degree in Manufacturing Engineering, Mechanical Engineering, Industrial Engineering, Electrical Engineering, or a related engineering discipline required. Internship, co‑op, or prior manufacturing experience in an electronics manufacturing environment is preferred. Equivalent combinations of education and relevant experience may be considered. #J-18808-Ljbffr