Postdoctoral Fellow: FEA & Reliability for Chip Packaging
The American Ceramic Society
The American Ceramic Society is hiring a PREP Research Associate for a CHIPS Funded Project at NIST. This role requires a Ph.D. in a relevant engineering or science field, focusing on modeling and mechanical testing for advanced semiconductor packaging. Responsibilities include developing finite element models, characterizing material degradation, and leading technical research efforts. Candidates should have experience in nano-scale mechanical testing and strong communication skills. U.S. citizenship is preferred. #J-18808-Ljbffr The American Ceramic Society
Vacancy posted 4 days ago
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