Materials Scientist / Process Development Engineer - Advanced Semiconductor Packaging

Location: Remote (U.S.)

Employment Type: Full-time

Base Salary: 140,000–180,000 + Equity + Bonus

Travel: 50%+ International Travel

About the Role:

We are seeking a Materials Scientist / Process Development Engineer to advance innovative materials and processes for next-generation semiconductor packaging and heterogeneous integration. This role focuses on dielectric materials, polymers, surface chemistry, and interface engineering to address critical thermal-management challenges in AI infrastructure and advanced computing.

You will take ownership of materials research, process development, experimental validation, and technical problem-solving within an early-stage technology environment, helping advance emerging technology from research through proof of concept.

Key Responsibilities:

• Develop and evaluate dielectric and polymer materials for advanced semiconductor packaging.
• Investigate surface chemistry, interface engineering, adhesion, material compatibility, and bond-void formation.
• Develop and optimize semiconductor processes, including plasma activation, ALD, CVD, PVD, CMP, electroplating, and wafer bonding.
• Perform materials characterization, failure analysis, and root-cause investigations involving delamination, cracking, oxidation, corrosion, and interfacial defects.
• Design experiments using Design of Experiments (DOE) and apply Statistical Process Control (SPC) to optimize process performance.
• Establish process windows, validate experimental results, and communicate technical findings and recommendations.
• Collaborate with engineering teams, research institutions, materials suppliers, and international technical partners.
• Independently investigate complex technical challenges and drive solutions from initial analysis through experimental validation.

Qualifications:

• MS or PhD in Materials Science and Engineering, Chemistry, Chemical Engineering, or a related technical field.
• Strong expertise in materials science applied to semiconductor processing or advanced packaging.
• Working knowledge of dielectric materials, polymers, surface chemistry, and material interfaces.
• Demonstrated ability to independently solve complex technical problems through experimentation and validation.
• Strong analytical, experimental design, root-cause analysis, and problem-solving skills.
• Typically 3–8 years of relevant industry or research experience.
• Existing U.S. work authorization; visa sponsorship is not available.
• Willingness to undertake 50%+ international travel , including potential extended stays of up to three months during the first year.

Preferred Qualifications:

• Experience with hybrid bonding, chiplet integration, wafer-level packaging, 3D IC, TSVs, fan-out packaging, or HBM.
• Familiarity with characterization techniques such as XPS, ToF-SIMS, TEM, AFM, FTIR, Raman spectroscopy, XRD, and ellipsometry.
• Experience with analytical or simulation tools such as JMP, Minitab, Python, MATLAB, or COMSOL.
• Background in semiconductor manufacturing, electronic materials, semiconductor equipment, or university and national laboratory research.

Why Consider This Opportunity?

Technical Ownership: Lead materials investigations and influence process development in an evolving technology environment.

Advanced Technology: Contribute to semiconductor packaging innovations supporting AI infrastructure and advanced computing.

Research & Development: Work on complex materials challenges and help move emerging technologies toward proof of concept.

Collaborative Environment: Engage with engineering teams, research institutions, and international technical partners.

Interview Process:

• The interview process includes three video interviews:
• Initial discussion with the Head of Engineering or a team member.
• Technical presentation on an advanced semiconductor packaging topic.
• Detailed discussion of a technical problem independently solved by the candidate. PhD candidates may present their dissertation research as an example.
• Candidates with strong materials-science expertise, hands-on experimental experience, and a passion for solving complex semiconductor challenges are encouraged to apply.