Low Yield Analysis (LYA) Group Leader/Operations Manager

Intel is shaping the future of technology to help create a better future for the entire world. Our work in AI, analytics, and cloud‑to‑edge technology powers major breakthroughs and improves the quality of life for everyone. This role requires regular onsite presence to manage employees whose responsibilities necessitate onsite work. Job Responsibilities Manage a team of yield development engineers and technicians, providing leadership on factory operation support and driving yield improvement roadmaps. Evaluate methods and tools to drive defect reduction and yield improvement, guiding development efforts with core competency and metrology groups. Develop strategies for optimal inline monitoring schemes and invent methods, including custom process flows and test layout designs, to detect EOL fails inline. Develop and deploy tools, algorithms, and methodologies for generation and analysis of in‑line and offline yield and defect data, applying statistical methods and drawing meaningful conclusions. Develop recommendations, drive yield and defect indicators, and manage communications with factory. Demonstrate ability to develop and harden equipment capable of meeting technology development and high‑volume manufacturing operational and capability needs for leading‑edge logic node. Develop long‑term strategies for process integration and yield engineering capabilities to support future requirements. Enable teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results. Drive results by inspiring people, role‑modeling Intel values, developing the capabilities of others, and ensuring a productive work environment. Oversee the start‑up of a new laboratory focused on back‑end advanced package fault isolation and failure analysis. Manage a team of engineers and technicians focused on characterization of in‑line defects, fault isolation, and subsequent failure analysis. Utilize strong presentation skills, interfacing with peer groups and upper management to drive overall program success. Help define data acquisition strategies and data analysis plans toward yield improvement. Other focus areas may include process and defect characterization, forecasting and driving implementation of forward needs for the broader organization and developing innovative techniques to accelerate failure identification and root cause mechanism understanding. Minimum Qualifications Master's Degree with 4+ years of experience or PhD with 2+ years of experience in Chemistry, Physics, Electrical Engineering, Mechanical Engineering, Materials Science or other relevant applied Engineering Degree. US Citizenship is required. Ability to obtain and maintain a US Government TS/CSI Security Clearance with Polygraph. 2+ years experience with Semiconductor or Advanced Manufacturing. 1+ year experience with capital equipment management and/or sourcing. 1+ years experience as a personnel manager or lead/mentor. Preferred Qualifications 8+ years Advanced Manufacturing or operations management experience. Active US Government TS/CSI Security Clearance with Polygraph. Previous experience in personnel management, preferably managing both technicians and exempt employees. Experience with capital equipment sourcing and install/qualification methodology. Knowledge of advanced packaging architectures, especially utilizing 2.5D and 3D disaggregation techniques. Experience with device physics and common Si fail modes and mechanisms. Experience with test program development and evaluations, especially parametric tests. Experience with electrical fault isolation of parametric structures. Familiarity with fab wafer processing, especially back‑end processing and advanced packaging assembly techniques. Knowledge of sample preparation and equipment for failure analysis such as mechanical cross‑sectioning, planar grinding, de‑lidding, FIB and SEM/TEM analysis. Good written and oral communication skills. Demonstrated problem solving, analytical and engineering troubleshooting capabilities. Benefits Intel offers a competitive total rewards package that includes health, retirement, vacation, stock bonuses, and other benefits. Additional details are available on Intel’s careers site. Equal Employment Opportunity Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. #J-18808-Ljbffr Intel Corporation