Advanced Packaging Technician

Job Description

Position summary

The Deca Advanced Packaging Technician runs process and metrology tools and moves development, qualification, and customer prototype lots through the advanced wafer-level packaging fab at Arizona State University's Macro Technology Works (MTW) in Tempe, AZ. The fab process is built on Deca's industry leading M-Series™ fan-out technology with Adaptive Patterning®.

This is a hands-on, cleanroom-based role. You will keep lots moving on schedule, run tools to recipe and procedure, catch problems early, and give engineers the clean data and clear handoffs they need to develop, qualify, and deliver M-Series packages to customers.

• Title: Deca Advanced Packaging Technician
• Location: Deca Technologies & ASU MTW in ASU Research Park in Tempe, AZ
• Reports to: Deca Sr. VP of Technology
• Type: Full-time, non-exempt

Key responsibilities

Run tools and move lots

• Operate wafer-level packaging process tools across the M-Series flow, including laser direct imaging (LDI) photolithography with coat or laminate, expose, & develop, PVD (sputter), electroplating, wet etch and strip, plasma clean, mold, grind, die measurement, AOI.
• Load, run, and unload lots to approved recipes, travelers, and work instructions; record every move accurately in the MES.
• Prioritize and move development, qualification, and customer prototype lots to hit committed cycle times and ship dates.
• Support Adaptive Patterning steps, including die-shift measurement and the handoff of unit-specific patterning data to the lithography tool.
• Perform split-lot, design-of-experiment (DOE), and special-instruction runs for engineering exactly as written.

Inspect, measure, and protect yield

• Run in-line metrology and inspection: film thickness, CD and overlay, plating height, warpage, along with optical and AOI defect inspection.
• Compare results to objective specs and SPC limits; place lots on hold and escalate out-of-control or unexpected results immediately.
• Handle wafers and reconstituted panels carefully to prevent breakage, scratches, contamination, and misprocessing.

Keep tools and the fab running

• Perform daily tool checks, qualification wafers, and first-level preventive maintenance; log tool status and downtime.
• Prepare, monitor, and replenish chemistries (plating baths, developers, etchants) and track bath life and analysis results.
• Follow cleanroom protocol, gowning, 5S, and EHS requirements, including safe chemical handling and waste disposal.

Communicate and improve

• Give clear shift handoffs on lot status, holds, and tool issues.
• Work with process, equipment, and integration engineers to troubleshoot, and suggest improvements to procedures and work instructions.
• Help train new technicians and student workers on tools and procedures once certified.

Required qualifications

• High school diploma or GED, plus one of the following: an associate degree or certificate in semiconductor manufacturing, electronics, or a related technical field; military technical training; or 2+ years of equivalent hands-on experience.
• 2+ years as an operator or technician in a semiconductor fab, advanced packaging, MEMS, or similar cleanroom manufacturing environment.
• Hands-on experience running at least one of: photolithography, electroplating, PVD, wet process, or metrology & inspection tools.
• Working knowledge of MES or lot tracking systems, travelers, and recipe-controlled processing.
• Understanding of SPC charts, out-of-control actions, and lot hold procedures.
• Strong attention to detail and the discipline to follow procedures exactly, especially on non-standard engineering lots.
• Clear written and verbal communication for shift handoffs and logs.
• Comfortable with basic computer tools (Microsoft Office, email, data entry).

Preferred qualifications

• Experience with fan-out wafer-level packaging (FOWLP), panel-level packaging, or redistribution layer (RDL) processing.
• Familiarity with Deca M-Series technology and Adaptive Patterning.
• Experience with copper plating, polymer dielectrics (such as polyimide or PBO), wafer molding, and backgrind.
• Experience supporting new product introduction (NPI), qualification builds, or customer prototype runs in a development or pilot-line fab.
• First-level tool troubleshooting and preventive maintenance experience.
• Exposure to automated optical inspection, warpage, or thin-film metrology tools.
• Experience in a university, R&D, or shared-user fab environment.

Work environment and physical requirements

• Work is performed in a Class 1,000 to 10,000 cleanroom in full gowning, including bunny suit, hood, gloves, face mask, and safety glasses.
• Must stand and walk for extended periods and lift up to 25 lb (wafer FOUPs, chemical containers, tool parts).
• Works with and near hazardous chemicals, gases, and high-voltage equipment; must follow all safety and PPE requirements.
• Must not wear cosmetics, fragrances, or other items restricted by cleanroom protocol while in the fab.
• Normal color vision and fine manual dexterity are needed for wafer handling and visual inspection.
• Shift: day shift, with occasional overtime, off-shift, or weekend work to support customer and qualification deadlines.

Must be able to obtain site access and meet any export-control requirements for the facility.