Senior Mechanical Engineer

Sr. Mechanical Engineer

Advantest Test Solutions, Inc. (ATS) is looking for a senior level Mechanical Engineer. This individual will perform a broad range of mechanical engineering functions related to the design, testing, and evaluation of hardware sub-systems for handling and testing electronic systems including semiconductors, embedded devices and co-packaged optics (CPO) devices. Develop and execute the detail design on new and/or modified existing designs in a fast-paced environment. Serve on product development team(s) and be assigned specific sub-assembly or sub-system mechanical design and testing responsibility. This role will require experience in electro-mechanical and automated systems, as can be found in leading semiconductor handlers and test systems.

Essential Duties and Responsibilities:

• Design new and/or modify existing electro-mechanical assemblies to meet specific end customer requirements. Can include PCB Assys with multiple PCBs and heatsinks.
• Complete all detail drawings, assembly drawings and Bills of Material for all initial manufacturing builds and eventual production level manufacturing.
• Identify technical risk areas and optimization opportunities.
• Present designs during internal Design Reviews.
• Develop test specifications and evaluation protocols.
• Perform electro-mechanical hardware, assembly and integration testing and final qualification testing.
• Interpret functional test results and present findings to senior technical staff or vendors and customers.
• Develop and implement mechanical design changes that are identified during testing or design verification review.
• Develop new or modified test equipment, manufacturing and inspection jigs and fixtures, as required.
• Work as part of a team that includes manufacturing, quality assurance and technical support organizations to establish functional specifications for components and to select vendors/suppliers for purchased parts, materials and assemblies.
• Work closely with external Technology partners and successfully accomplishes common product design/ production goals.
• All other duties as assigned.

Requirements, Education and Skills:

• Requires a BS degree in Mechanical Engineering or similar.
• Ideal candidates have 6 - 10+ years of experience, preferably in a high-technology environment.
• Experience working in cross-functional teams that build complex electro-mechanical systems comprised of closed-loop motion control hardware, electrical and software components is required.
• Experience in SolidWorks or similar 3D CAD system is required.
• Experience in creating and interpreting mechanical detail and assembly drawings using ASME-Y14.5M GD&T standards is required.
• Experience using CAD based FEA tools to check and optimize mechanical parts against structural requirements is required.
• Experience in electronic packaging, testing and integrating thermal systems into automated equipment is also preferred.
• Experience in failure prediction and analysis methods and processes like DFMEA, wishbone diagrams, 5 Whys or 8D Reports is required.
• Knowledge of thermal dynamics and CFD experience may be required to perform air flow analysis or thermal analysis.
• This is an on-site role in our Lake Forest, CA facility.

Additional Skills Preferred (but not required):

• Experience with the architecting, design, certification and deployment of semiconductor capital equipment.
• Experience with using PDM (MechWorks) Software tools to manage system hardware design configurations and documentation.

• Experience with machine frame design and/or nineteen-inch electrical rack assembly design.
• Experience using 3D printers to create fast prototype or demonstration parts and assemblies.
• Contributed to the mechanical design and packaging of Co-Packaged Optics (CPO) modules, focusing on thermal management, EMI shielding, and optical alignment.
• Participated in cross-functional design reviews involving mechanical, electrical, and thermal disciplines to meet performance and reliability targets.
• Supported prototyping and testing of electro-mechanical assemblies, including load carrying performance, pressure distribution, environmental stress screening and vibration testing.
• Collaborated with external partners to develop chillers, condenser units or HVAC systems.
• Experience in semiconductor wafer handling, electrical device handling and/or factory automation equipment used in semiconductor device manufacturing or testing.