STCO Research Engineer Intern - 3D/2.5D Packaging
Intel
Intel's Foundry System Technology team seeks an Research Engineer Intern to help advance STCO methodologies and evaluate 3D/2.5D dis-aggregation schemes using solder microbumps or hybrid bonding for memory and logic stacking. You will collaborate across teams to push semiconductor innovations. The role offers a hands-on internship with exposure to cutting-edge packaging technologies, DRAM/SRAM considerations, and industry-leading processes in a hybrid work model. #J-18808-Ljbffr Intel
Vacancy posted 12 hours ago
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