Systems Architect for High-Performance Systems

Systems Architect for High-Performance Systems We are seeking a highly skilled and experienced System Architect to develop the cutting edge next‑generation hardware systems tailored for high‑performance computing (HPC) and artificial intelligence (AI) workloads. This role demands deep expertise in electrical and mechanical systems, system‑level architecture, and high‑speed interconnects operating at 112 Gbps‑PAM4 and beyond. What You Will Do Provide thought leadership in designing scalable, reliable, and high‑performance hardware architectures. Define system‑level requirements across electrical, thermal, and mechanical domains and translate them into robust reference designs. Collaborate cross‑functionally with thermal and mechanical teams to ensure seamless technology integrations. High‑Performance Hardware Development Architect systems optimized for AI and HPC environments, that target GPU, TPU, IPU, and other accelerator‑based platforms. Define and manage signaling budgets across chips using SerDes, retimers, and linear amplifiers for ultra‑high‑speed data paths (112 Gbps‑PAM4, 224 Gbps‑PAM4). Drive innovation in power delivery, signal integrity, and thermal solutions to meet demanding performance targets. Technical Leadership & Mentorship Serve as a subject matter expert in SerDes performance, retimer/redriver technologies, and complex hardware systems. Participate in design reviews and promote best practices across engineering teams. Mentor junior engineers and foster a culture of technical excellence. Stay current with emerging technologies, tools, and methodologies to enhance system performance. Identify bottlenecks and propose optimizations based on industry experience and benchmarking. Who You Are (Basic Qualifications) Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. 10+ years of experience in hardware design and architecture for high‑performance systems. Deep expertise in power delivery, signal integrity, and thermal management. Proven experience with SerDes, retimers, and linear amplifiers at 112 Gbps‑PAM4 and higher. Strong collaboration and communication skills across multidisciplinary teams. Proficiency in PCB layout, CAD tools, and electromagnetic simulation (e.g., HFSS). Strong analytical and troubleshooting skills for complex multi‑domain issues. What Will Put You Ahead Experience designing and scaling hardware for AI inference and training workloads. Familiarity with advanced packaging technologies. Hands‑on experience with switch ICs and AI accelerators (GPU, TPU, IPU). For this role, we anticipate paying $150,000 - $200,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form. The benefits plan includes medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance. Specific eligibility criteria is set by the applicable Summary Plan Description, policy or guideline and benefits may vary by geographic region. If you have questions on what benefits apply to you, please speak to your recruiter. Equal Opportunity Employer, including disability and protected veteran status. Except where prohibited by state law, some offers of employment are conditioned upon successfully passing a drug test. This employer uses E‑Verify. Please click here for additional information. (For Illinois E‑Verify information click here, aquí, or tu). Locations: Houston, Texas | Katy, Texas | Scottsdale, Arizona | Tulsa, Oklahoma | Wichita, Kansas #J-18808-Ljbffr