Process Development Engineer | RF Photonics

Senior Silicon Photonics Process Engineer - Heterogeneous IntegrationLocation: Dallas, TX, or Lehi, UTGroup: Kilby LabsWe can't predict what the future holds, but we know Texas Instruments will have a part in shaping it. Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets. About the PositionKilby Labs is seeking a highly motivated and experienced Silicon Photonics Process Engineer to lead the development and implementation of heterogeneous integration (HI) of non-Si modulator materials into high-volume silicon photonics. This role is responsible for the initial process development through volume scaling of all aspects of the HI process module including layer transfer and post transfer processing. The role requires working extensively across other internal teams including advanced process technology development, fab operations, chip design and test, and product engineering, to make innovative, high performance and cost-effective silicon photonics solutions, while also requiring a focus on high-yield, reliable, and cost-efficient manufacturing. For this role we are seeking a creative problem-solver who can develop unique, breakthrough technologies. Responsibilities may include, but are not limited to:Lead the process development, execution, and optimization of volume die-to-wafer (D2W) bonding and post-bond device processing of non-Si material chiplets, integrated in silicon photonics.Owning part or all the non-Si material chiplet integration process module in the cleanroom; including the processes of dicing, grinding, die-to-wafer bonding, and waveguide etching.Drive the scaling of the heterogeneous integration processes from initial R&D and prototyping phases up to high volume manufacturing.Provide necessary expertise to bridge the internal fab operations, advanced process development, and Kilby R&D design teams to align HI processes with device performance requirements and fab capabilities.Work with tool vendors and IP partners to reduce process development time leveraging external IP.Work closely with photonic design, architecture, and packaging teams to translate design, layout, and product requirements into cost and yield optimized manufacturing solutions.Establish robust process controls, root-cause failure analysis, and yield enhancement strategies to drive cost and power improvements, ensure high manufacturing yield and long-term device reliability.Develop process characterization and troubleshooting procedures, including development of process monitors, test structures, critical to quality parameter specifications, metrology and inspection procedures, and correlations with device performance data. Develop and maintain process reporting and documentation, including process flow descriptions, quality specifications, goal plotting, and yield reports.Research and develop differentiating process techniques beyond the state of the art.Why TI?Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TIBenefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits hereAbout Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Minimum Requirements:Master’s/Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science. 3+ years of industry experience with one or more of the following processing steps for integration of non-Si high-speed modulator materials onto silicon photonics in a high volume silicon photonics fab environment: planarization and pre-bond surface preparation, die-to-wafer bonding, wafer-to-wafer bonding, post-bond waveguide etching and processing, and metallization.Experience with material physics and process-related effects on device performance for materials such as Lithium Niobate, Lithium Tantalate, Barium Titanate, or Indium Phosphide.Track record of delivering high yield process modules for high speed silicon photonics fab processes involving heterogeneous integration of non-materials in high volume manufacturing.Strong expertise in statistical process control (SPC), design of experiments (DOE), and utilizing advanced material characterization techniques applied to Cpk optimization for silicon photonics with HI of non-SI materials.Ability to work independently and lead cross-functional collaboration between process, fab, and design teams.Preferred Qualifications:Understanding of the mechanisms of direct bonding methods (i.e. fusion bonding) and surface chemistry of bondingHands-on cleanroom experience with dicer, grinder and bonder (die-to-wafer or wafer-to-wafer).Knowledge of high-speed photonic modulator device physics, device design, and important device performance metricsUnderstanding of characterization and testing of high-speed modulators and silicon photonic devicesExperience with volume manufacturing of high speed integrated photonic devices for state-of-the-art data communications products.Experience using process monitor and test data analysis tools and statistical analysis tools such as JMP or statistical libraries (e.g. Matlab, Python).Strong verbal and written communication skills.Ideal candidates must also excel at promoting new ideas, building collaborative relationships, working across organizations.Full timePosting Date: 2026-09-21