Senior ASIC Design Engineer - ML Chips & 2.5D Packaging
Jobleads-US
Annapurna Labs (U.S.) Inc. in Austin, TX seeks an experienced ASIC engineer to define, design and validate AWS next generation ML chips, cards and server integration.
You will work across HBM, memories and Serdes, coordinate with vendors, write tests, review designs, and participate in code reviews and cross-functional planning to deliver the next generation ML chip and its 2.5D packaging in a demanding AWS datacenter environment.
#J-18808-Ljbffr Jobleads-USVacancy posted 2 days ago
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