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Staff Package Design Engineer: Multi-Chip & Power Modules

Jobleads-US

Renesas Electronics Corporation in Tempe, AZ (or Austin, TX) seeks a Staff Package Design Engineer to advance high-performance semiconductor package solutions including power modules, FCBGA, SiP, WLCSP, and multi-die architectures. You will collaborate with silicon design, SI/PI, thermal, reliability, and manufacturing teams to ensure robust, manufacturable designs.

The role emphasizes package layout execution, DFM/DFA adherence, and cross-domain co-design across global engineering teams to

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Vacancy posted 14 hours ago
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