Sr. PrincipalStaff PCB Layout Designer

DPP is seeking a Sr. Principal/Staff PCB Layout Designer for an opportunity with our client in the Aerospace and Defense Manufacturing industry.

Work Location: Onsite in Cincinnati OH
Duration: 6 months
Terms: W2 Contract
Work Authorization: US Citizen; must hold a current/active Top Secret SCI clearance

Responsibilities:

• Execute the placement and routing of complex high density multi layer printed circuit boards (PCBs) including high speed digital RF mixed signal and power circuits.
• Interpret electrical schematics constraints and mechanical boundaries to develop optimized PCB layouts that meet performance reliability and manufacturability requirements.
• Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages including artwork drawings fabrication notes and data outputs for procurement and assembly partners.
• Apply current IPC and high reliability industry standards as well as applicable military and aerospace criteria in the design and verification of printed wiring boards and circuit card assemblies.
• Collaborate closely with electrical mechanical manufacturing and signal integrity engineers to address layout related design challenges involving signal integrity power integrity thermal management and packaging.
• Support and perform Design for Manufacturing (DFM) Design for Assembly (DFA) and Design for Test (DFT) reviews using automated and manual checks to improve yield test coverage and product robustness.
• Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs.
• Support PCB library management practices ensuring correct use of symbols footprints and parameter data in accordance with internal workflows.
• Independently own PCB layout tasks from concept through fabrication data release in support of program cost schedule and technical requirements.
• Lead advanced PCB layout efforts using technologies such as High Density Interconnect (HDI) microvias via in pad backdrilling and specialized substrate materials; provide technical guidance peer reviews and mentoring to other layout designers.
• This position may be filled at either a Sr. Principal Level or a Staff Level.
• This requisition may be filled at a higher grade based on qualifications listed below.

Required Qualifications for a Sr. Principal PCB Layout Designer:

• 8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD Active Top Secret clearance.
• Active Top Secret clearance.
• Willingness and ability to work on site full time at the Cincinnati OH location.
• Minimum 8 years of experience performing engineering/layout of printed circuit boards using Xpedition.
• Experience with the layout of multi layer high density PCBs and circuit card assemblies including placement and routing of high speed digital RF and/or mixed signal circuits.
• Experience collaborating with diverse stakeholders across organizations and programs including electrical design mechanical design manufacturing test and/or signal integrity.
• Working knowledge of PCB fabrication and assembly processes including common manufacturability and yield considerations.
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria.
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
• Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements.

Required Qualifications for a Staff PCB Layout Designer:

• 12 Years with Bachelors in Science; 10 Years with Masters; 8 Years with PhD.
• Willingness and ability to work on site full time at the Cincinnati OH location.
• Minimum 12 years of experience performing engineering/layout of printed circuit boards using Xpedition.
• Experience with the layout of multi layer high density PCBs and circuit card assemblies including placement and routing of high speed digital RF and/or mixed signal circuits.
• Experience collaborating with diverse stakeholders across organizations and programs including electrical design mechanical design manufacturing test and/or signal integrity.
• Working knowledge of PCB fabrication and assembly processes including common manufacturability and yield considerations.
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria.
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses.
• Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements.

Preferred Qualifications:

• Prior experience in defense or space flight programs with stringent reliability documentation and traceability requirements.
• Demonstrated expertise in the layout of advanced high density multi layer printed circuit boards combining RF high speed digital and high power circuit sections.
• Knowledge of PCB process workflows and library management including creation and governance of symbols footprints and reusable layout elements.
• Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules.
• Deep domain knowledge of high reliability military and aerospace hardware criteria (e.g. MIL PRF 31032 MIL STD 883 IPC Class 3/3A) or comparable experience demonstrating equivalent rigor.

Interested Learn more:
Click the apply button to learn more about this position (#26-01310).

DP Professionals (DPP) offers a range of compensation and benefits packages to our employees and their eligible dependents. DPP is a certified Woman-owned Small Business Enterprise (WBE and WOSB) with more than 25 years in the staffing industry. EOE/AA/V/D

Required Experience:

Staff IC