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Senior Substrate & Advanced Packaging Engineer (3DIC)

Jobleads-US

TSMC seeks a seasoned Substrate / Advanced Package Engineer to advance 3DIC packaging and CoWoP initiatives. You will leverage a strong foundation in semiconductor physics, mechanical engineering, and EDA tooling to drive design, simulation, and modeling of complex substrate technologies.

The role emphasizes solving warpage and thermal challenges, collaborating across teams, and delivering documentation for design reviews and project milestones.

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Vacancy posted 3 days ago
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