Senior Advanced Semiconductor Engineer

As a MEMS Design and Integration Engineer, you will own the development and optimization of cutting-edge semiconductor technology nodes. You will work at the intersection of device design, process technology, electrical characterization, and yield engineering, tuning fabrication conditions to meet strict electrical and reliability targets. This position supports silicon-based microelectromechanical systems (MEMS) sensor technologies for medical, commercial, industrial, automotive, defense, and space applications. This role combines innovative research with practical engineering applications, contributing to advancement of cutting-edge sensor technologies. Honeywell helps organizations solve the world's most complex challenges in automation, the future of aviation and energy transition. As a trusted partner, we provide actionable solutions and innovation through our Aerospace Technologies, Building Automation, Energy and Sustainability Solutions, and Industrial Automation business segments – powered by our Honeywell Forge software – that help make the world smarter, safer and more sustainable.YOU MUST HAVEMinimum B.S. in Electrical Engineering, Materials Science, Physics, or a related field (M.S. or Ph.D. preferred for advanced R&D). Minimum of 7 years of hands-on experience in semiconductor fabrication, process integration, device engineering, and device characterization. Experience with process integration and design, especially for MEMS pressure sensors, is a must. Deep understanding of semiconductor device physics, the interaction of various semiconductor unit processes, and device testing. Familiar with semiconductor fabrication processes (diffusion, implant, wet, photolithography, plasma, metal deposition, parametric testing, saw).  Experience with process integration, especially for pressure sensors. WE VALUEProficiency with statistical analysis and data mining tools (e.g., SPC, JMP, YieldMiner, or similar). Strong project management, interpersonal, and cross-functional leadership capabilities to align multiple engineering modules toward a common product goal. U.S. PERSON REQUIREMENTSDue to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status or have the ability to obtain an export authorization.BENEFITS OF WORKING FOR HONEYWELLIn addition to a performance-driven salary, cutting-edge work, and developing solutions side-by-side with dedicated experts in their fields, Honeywell employees are eligible for a comprehensive benefits package. This package includes employer-subsidized Medical, Dental, Vision, and Life Insurance; Short-Term and Long-Term Disability; 401(k) match, Flexible Spending Accounts, Health Savings Accounts, EAP, and Educational Assistance; Parental Leave, Paid Time Off (for vacation, personal business, sick time, and parental leave), and 12 Paid Holidays. For more information visit: Benefits at HoneywellThe application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates. Posting Date: 8/10/2026ABOUT HONEYWELL TECHNOLOGIESHoneywell Technologies is a global, pure-play automation company with a legacy of innovating to help solve the world’s most mission-critical challenges, enhancing the quality of life for people and communities around the world. We serve the building, industrial, and process sectors with a broad portfolio of services, solutions, and products, underpinned by our Honeywell Technologies Accelerator operating system and Honeywell Technologies Forge intelligence layer. By combining the deep domain expertise of our more than 50,000 employees with decades of data from our global installed base, we are uniquely positioned to lead the industrial sector’s transition from automation to autonomy.THE BUSINESS UNITHoneywell Industrial Automation (IA) is a leading provider of integrated automation and software solutions, control systems, and services for the process industries. Our solutions help customers improve productivity, reduce costs, and minimize downtime. We are dedicated to delivering innovative solutions that enable our customers to achieve their business objectives and drive sustainable growth. MEMS Sensor Design Development: Develop sensor chip design for pressure, air flow, liquid flow, magnetic, chemical, and electrochemical sensing. Process Flow Definition: Develop, document, and optimize integrated front-end and back-end process flows for new technology nodes. Device Performance Optimization: Assist with electrical characterization of MEMS devices under development. Utilize knowledge of semiconductor device physics to drive performance, parametric Cpk improvements, and overall yield. Cross-Functional Leadership: Coordinate with specialized teams—including Lithography, Etch, Thin Films, CMP, and Metrology—to execute experiments and resolve integration issues. Data Analysis & Experimentation: Plan and execute Design of Experiments (DOE). Analyze yield data, identify root causes of parametric outliers, and define corrective actions. Technology Transfer: Support the scale-up and transfer of advanced technologies from R&D to High-Volume Manufacturing (HVM). Failure Analysis: Partner with reliability and failure analysis (FA) teams to diagnose electrical failures and validate device robustness. Full timePosting Date: 2026-08-10