Package Architect - Advanced Packaging & System Exploration

Responsibilities Define and explore advanced package architectures for future memory systems Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability Create hands‑on package designs and models for early feasibility analysis Run SI/PI and thermal simulations and translate results into architecture guidance Define package requirements and act as extension architecture and engineering Minimum Qualifications Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field 10+ years of hands‑on experience in package design or package‑level simulation Strong experience with package SI modeling and analysis Ability to independently build models and drive conclusions Preferred Qualifications Master’s degree in a related technical field Experience supporting architecture or pre‑silicon exploration teams Familiarity with system‑level co‑design across silicon, package, and board Experience with multi‑die or heterogeneous integration Salary: $177,000.00 - $387,000.00 per year. Additional compensation may include benefits, bonuses and equity. Benefits: Micron offers medical, dental and vision plans, income protection, paid family leave, paid time‑off program and holidays. Benefit details are available on the Micron careers benefits guide. EEO Statement: Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr