Laser Packaging Development Engineer
Intel
Intel is seeking a Packaging Module Development Engineer in Laser Assembly based in Phoenix, AZ. You will design laser-assisted packaging processes, optimize performance, and collaborate across teams to advance next-generation semiconductor packaging. The role emphasizes DOE-driven process development, data analysis, and ensuring manufacturability and reliability of packaging solutions in a fast-paced environment. #J-18808-Ljbffr Intel
Vacancy posted 3 days ago
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