ASIC Package Engineering Co-op - Shape Next-Gen Packaging
Advanced Micro Devices, Inc.
AMD in Austin, TX is seeking a motivated ASIC Package Engineering intern/co-op to join our team and help bring advanced packaging technology to reality while you learn from a team of engineers. You'll support package design, interposer and bump design, verification, and yield analysis, with opportunities to benchmark materials and collaborate with partners for cost-effective, high-yield solutions. This role requires enrollment in a US university in relevant engineering degree; full-time #J-18808-Ljbffr Advanced Micro Devices, Inc.
Vacancy posted 3 days ago
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