Sr. Packaging Engineer

Elevate Quantum (EQ) is America’s Quantum Tech Hub—designatedby the U.S. Department of Commerce andrepresentingthe largest concentration of quantum organizations in the world. EQoperatesat the center of a rapidly scaling ecosystem spanning industry, academia, national laboratories, and government across Colorado, New Mexico, and Wyoming. Our mission is to accelerate the commercialization of quantum technology and translate regional scientific leadership into lasting economic impact. EQ is not a traditional nonprofit—it is an execution engine responsible for deploying capital, standing up infrastructure, and delivering measurable outcomes across a diverse portfolio of programs. The organization operates across five core business units: Advanced Packaging Facility Focused on high-mix, low- to medium-volume production, this facility supports quantum and advanced photonics companies with capabilities in optoelectronics packaging such as flip chip bonding, solder attach, wire-bonding, fiber-to-chip coupling, and various metrology capabilities. In partnership with Sandia National Laboratories, EQ is helping bridge the gap between research and scalable manufacturing. Photonic Integrated Circuit (PIC) Fabrication Facility A rapid-turn, low-volume fabrication facility designed for quantum-relevant materials (including silicon nitride and lithium niobate), enabling significantly faster iteration cycles than traditional foundries and supporting early‑stage and scaling companies alike. Commercialization Labs A shared‑use environment offering access to advanced equipment, lab space, and the nation’s first open‑access, open‑architecture quantum system. These labs provide critical infrastructure for testing, prototyping, and validating emerging technologies. Workforce Development Spanning Colorado and New Mexico, EQ’s workforce programs combine ecosystem coordination with hands‑on training delivered on real equipment. These programs are designed to build the next generation of quantum technicians and support a rapidly growing talent pipeline. Consortium Engagement EQ manages a 150+ member coalition and convenes the broader ecosystem through advisory boards, CEO roundtables, major events, and cross‑state collaboration. The organization also partners with state and regional entities to attract companies, align strategy, and drive continued investment into the region. Together, these business units form a vertically integrated platform—one that spans infrastructure, talent, commercialization, and ecosystem activation. EQ’s role is to ensure these components operate cohesively to accelerate the path from scientific breakthroughs to commercial deployment at scale. JOB SUMMARY Reporting to the Director of Packaging, the Sr. Packaging Engineer will drive the development of optoelectronic packaging and integration processes, qualifying them and supporting the launch of new processes. As part of the development team, the Sr. Packaging Engineer will help identify and develop innovative solutions to process and manufacturing challenges in a team‑based and fast‑paced environment. ESSENTIAL JOB FUNCTIONS Planningand executingexperiments forthedevelopment of newelectronicand photonicpackaging processes (joining such as flip chipand wire bonding,reflow processes, optical couplingsuch as fiber to shipattach etc.). Employingvariousmetrology tools andtechniques,and reliability tests to understand and improve the performance of theprocesses. Optimizingassemblyprocesses,FMEAand root cause analysis. Compilingand analyzingdata,writingreports, and presentingresults to team members and management. Supportingthe launchof new processesand trainingmanufacturing personnel. Maintaining and improving the established processes andequipment,andproviding support to production and troubleshooting technical issues. Interfacingwithvendors of equipment andprocess materials. JOB QUALIFICATIONS & REQUIREMENTS Required qualifications: M.S. or Ph.D. in Physics, Materials Science, Mechanical Engineering, Chemistry or related field. Minimum3-7years of experiencewith photonic systems and integration, electronic packaging, solder systems and reflow processes in a high- techindustry (Quantum, MEMS, semiconductor, or PCB). Strong foundationof materials scienceand opticsprinciples and hands‑on experience withfiber alignment procedures, flip chip bonders, wire bonders and reflow ovens. Hands‑on experience in setting up and maintaining optoelectronic packaging processes, equipment and metrology methods for the control and monitoring of such processes. Experience with diagnosing issues using failure analysis techniques and equipment, researching, and recommending solutions. Experiencewith,profilometry,surface and bulk analytical methods relevant to characterization of thin films (e.g.XPS, XRD, EDX). Strong statistical analysis and data mining capabilities with tools like JMP and Excel. Strong and independent problem‑solving skills. Excellent written and verbal communication skills and ability to work as a team player in a fast-paced environment. Self‑motivated, attention to detail, ability to prepare technical reports by collecting, analyzing, and summarizing information, as well as writing technical specifications and procedures. Preferred qualifications: Experience with technology transfer from R&D into manufacturing Familiarity with quantum subsystems and hardware infrastructure preferred. Six sigma or statistical process control training Compensation and Location: Based in the Greater Albuquerque, New Mexico #J-18808-Ljbffr