SiC Wafer and Package Technology Development Engineer
onsemi
SiC Wafer and Package Technology Development Engineer Scottsdale, AZ, United States and 1 more Job Description Technical and customer support for the qualification of SiC die sales and development SiC wafer die sales is a main focus for onsemi and is critical to its future. This opportunity is for those who are technically focused and thrive on solving complex challenges and leading global teams to create future technology platforms and intellectual property for onsemi. Responsibilities Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify the next generation of SiC technologies which meets the cost, performance, manufacturing, timeline and reliability goals Lead and organize efficient development methodologies to address issues and lead technology development through cross functional teams Understand detailed customer requirements and verify latest technologies meet or exceed all expectations Document findings and process flows to create baseline for new technology platforms Lead maturity gate reviews, publish progress reports to executives and peers on monthly and quarterly basis. Qualifications Ability to lead development projects and implement strategies on a global basis Knowledge of post fab processing such as wafer thinning, sputter, electroplating, electroless plating, photolithography, wafer bonding. Knowledge of wafer level packaging, package assembly and component processes such as: wirebond, sintering, die attach, clip attach, reflow, molding Knowledge of materials and material interactions Required Skills Influence & Presence Metallization Program Management Semiconductor packaging onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression or any other protected category under applicable federal, state or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact View email address on click.appcast.io for assistance. #J-18808-Ljbffr onsemi
- ...The Qualification Of Sic Die Sales And Development Technical and... ...development SiC wafer die sales is a main... ...teams to create future technology platforms and intellectual... ...of wafer level packaging, package assembly and... ...611 Job Category Engineering Degree Level Masters...SuggestedFull timeLocal areaShift work
- ...onsemi is looking for a SiC Wafer and Package Technology Development Engineer in Scottsdale, AZ. The role focuses on technical and customer support for SiC die sales and development, which is vital for the company's future. You will lead global teams to address complex...Suggested
$99.03k - $139.81k
A leading technology company is seeking a qualified candidate for an on-site role focused on advanced semiconductor packaging solutions. Responsibilities include developing testing processes and collaborating with suppliers for innovative technologies. Candidates should...Suggested$99.03k - $139.81k
...Job Description: The Module Engineer On Shift (MEOS) provides real... ...substrate panels to collect development and process data. Write and... ...semiconductor manufacturing or packaging substrate development.... ...journey to shape the future of technology-apply today. Job Type: Experienced...SuggestedFull timeInternshipLocal areaImmediate startAll shiftsShift workNight shift- ...seeking a Reliability Staff Engineer to join our team in Scottsdale... ...team responsible for delivering technology and products that exceed... ...with a strong focus on chip-package interactions, advanced power... ...across silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies...SuggestedFull timeLocal areaShift work
- Intel is seeking a Module Development Engineer to join their Sort and Test Technology Development division in Phoenix, Arizona. You will lead the design and implementation... ...'s product delivery by advancing and optimizing packaging solutions. The ideal candidate will have a solid...
$49.19k - $67.64k
...farthest reaches of space, our technologies push the boundaries of what's... ..., high-quality solar wafers, and innovative photovoltaic... ...anomalies to supervisors or engineers as needed Follow standardized... ...Corning offers you the total package. Your well-being is our priority...Full timeInternshipWork at officeWeekend work$25 - $34.7 per hour
...global leader in materials engineering solutions used to produce virtually... ...enables the exciting technologies that literally connect our world... ...responsible for preparing wafers for experimentation,... ...to a comprehensive benefits package, candidates may be eligible...Flexible hoursShift work$25 - $34.7 per hour
...leader in materials engineering solutions used to produce... ...enables the exciting technologies that literally... ...responsible for preparing wafers for experimentation,... ...to focus on process development by owning tool operation... ...benefits package, candidates may be eligible...Full timeRelocationFlexible hoursShift work$109.6k - $154.8k
...Job Description About the Role Join Intel’s Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor... ...standardization of qualification processes, quality systems, and engineering methodologies Behavioral traits that we are looking for :...Work experience placementLocal area- ...Position Title: Packaging Development Engineer Location: Remote (Candidates must be based in AZ, CA, MD, IL, or GA ) Classification: Exempt (Salaried) Work Schedules: Full-Time; Requires frequent travel to manufacturing sites in AZ and MD . Summary...Full timeContract workFor contractorsLocal areaRemote work
$100k - $160k
...seeking a Senior Microgrid Design Engineer (remote position) to support HESG project development throughout our North America... ...for RFPs, including technical package preparation, bid evaluation,... ...facing briefings on grid-edge technologies, clearly articulating system...Contract workTemporary workRemote workFlexible hoursShift work$80.75k - $111.03k
...reaches of space, our technologies push the boundaries of... ...polysilicon, high-quality solar wafers, and innovative... ...and supporting early development of new products and... ...organizational levels (engineers, operators, and leadership... ...offers you the total package. Your well-being is...Full timeShift work$51.71k - $85.34k
...been at the forefront of technological advancement, creating the... ...autonomous systems. Our Advanced Packaging Technology Development team is pioneering next-generation substrate and wafer assembly solutions that... ...collaboration with Module Engineering teams Address and...Hourly payInternshipLocal areaImmediate startShift work3 days per week1 day per week$115.11k - $219.55k
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies... .... The Packaging Module Development Engineer will contribute to advancing technology...Local areaShift work$60.45k - $85.34k
...Description: Become a part of Intel's Advance Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization. Our... ...reliability. • Work closely with Module Engineering to execute experiments, implement equipment...Hourly payInternshipLocal areaShift work3 days per week$51.71k - $99.77k
...Advanced Packaging Technology Development: Substrate And Wafer Assembly (APTDSWA) Organization Become a part of Intel's Advance Packaging Team by joining... ...maintain system reliability. Work closely with Module Engineering to execute experiments, implement equipment...Hourly payInternshipLocal areaShift workNight shift3 days per week- The Utility Development Project Engineer will support the overall planning and execution of QTS utility... ...eligible for a competitive benefits package that includes medical, dental, vision... ...complaint or discrimination claim. #J-18808-Ljbffr Quality Technology Services, LLCFor contractorsWork at officeImmediate startFlexible hours
$70.67k - $99.77k
...Overview Manufacturing Equipment Technician in Advanced Packaging Technology Development – Substrate and Wafer Assembly (ATPD: SWA) team; responsible for... ..., operating or repair manuals, rough sketches, or engineering drawings. Perform setup, calibration, and preventive...Hourly payWork at officeLocal areaShift workDay shift$52k - $200k
...create the next generation of technologies that will shape the future... ...functions associated with the Wafer movement within the Ocotillo... ...technicians, managers, engineers, and others as needed. Expectations... ...-edge silicon process and packaging technology leadership for...Hourly payContract workPart timeApprenticeshipWork experience placementSummer workInternshipLocal areaImmediate startFlexible hoursShift workNight shiftDay shift3 days per week$52k - $200k
...functions associated with all wafer production including... ...module technicians, managers, engineers, and others as needed. Expectations... ...and/or electronic engineering technology. Preferred Qualifications: Completion... ...offer a total compensation package that ranks among the best in...Hourly payFull timeContract workPart timeLocal areaShift work$60.45k - $85.34k
...Details: Become a part of Intel's Advance Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization. Our... ...degree in a STEM field (Science, Technology, Engineering, or Mathematics). High School Diploma/GED...Hourly payLocal areaImmediate startShift work3 days per week$70.67k - $99.77k
...Manufacturing Equipment Technician Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help drive leading-... ...operating manuals, repair manuals, sketches, and engineering drawings. Performing equipment setup,...Hourly payWork at officeLocal areaImmediate startShift workDay shift$133.8k - $219.55k
...Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency... ..., material selection and process development to meet those needs, based on... ...technology development and partner engineering groups on process/technology maturity...Full timeContract workInternshipLocal areaImmediate startShift work$133.8k - $188.89k
...years of experience or Ph.D degree in Physics or Mechanical Engineering or Material Science or Electrical Engineering or... ...) Preferred Qualifications Prior experience working in wafer level and/or package assembly, and familiarity of process flow, tools, yield issues...Local areaImmediate startShift work- ...collaterals for assembly processes. The role emphasizes optimizing manufacturing efficiency, technical innovation, and collaboration with engineering teams. Candidates should possess a degree in a relevant field and strong knowledge of design software like SolidWorks. This...
$155.52k - $219.55k
Job Details Advanced Packaging Technology and Manufacturing (APTM) Yield Organization is looking... ...of experience in Physics, Mechanical Engineering, Material Science, Electrical Engineering... ...Prior experience working in wafer level and/or package assembly, familiarity...Local areaShift work$58.21k - $80.04k
...the depths of the ocean to the farthest reaches of space, our technologies push the boundaries of what's possible. At Corning, there are... ...experience, training, and education. Corning offers you the total package. Your well-being is our priority. Our compensation and...Full timeWeekend work- ...-edge semiconductor process technology (N4 process), starting production... ...judgment directly affects wafer yield, line stability, and... ...are assigned to specialized engineering modules, such as Lithography... ..., and simulation. Skill Development: Advance from mastering operations...Work at officeLocal areaImmediate startWorldwideFlexible hoursShift workNight shiftDay shift3 days per week
$88.88k - $130.35k
...Business Development Manager (Applications Sales Engineer) Job Overview: We are currently seeking a talented professional... ...technical expertise and Linde technologies portfolio. Reporting to the... ...compensation and an outstanding benefits package. Enjoy access to health, dental,...Base plus commissionLocal area
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