Sr. Analog Design Engineer, HBM

Job Description You will design and deliver the analog and mixed‑signal circuits that enable high‑performance High Bandwidth Memory (HBM) products. Your work will directly impact bandwidth, power efficiency, and reliability for AI, high‑performance computing (HPC), and data center systems. You’ll own critical analog blocks from architecture through silicon bring‑up and collaborate closely across design, layout, and test teams. Responsibilities Build and own circuits involving analog and mixed‑signal technologies for High Bandwidth Memory (HBM). This work covers high‑speed transmitters and receivers, PLLs, DLLs, CDR, SerDes, and circuits for biasing, reference, calibration, and power regulation. Translate system requirements into robust analog architectures that meet bandwidth, jitter, noise, power, and area targets. Perform pre‑layout and post‑layout simulations, including process, voltage, and temperature (PVT) analysis, Monte Carlo simulations, mismatch analysis, and aging and reliability checks. Partner with layout engineers to guide floorplanning, symmetry, matching, shielding, and electromigration and voltage‑drop (EM/IR) requirements. Review and sign off analog layouts and drive layout‑aware design improvements for advanced semiconductor process nodes. Collaborate with analog, digital, system, packaging, and test teams to ensure successful integration and silicon bring‑up. Minimum Qualifications Proficiency with SPICE‑based simulators such as Spectre, HSPICE, or similar tools, and experience with advanced complementary metal‑oxide‑semiconductor (CMOS) process nodes. Strong understanding of device physics, analog layout techniques, and process, voltage, and temperature (PVT) variation and reliability considerations. Master’s degree or equivalent experience in Computer Engineering, Electrical Engineering, or a related field. 5+ years of hands‑on experience in analog or mixed‑signal integrated circuit (IC) design. Preferred Qualifications Experience with dynamic random‑access memory (DRAM) subsystem architecture, specifications, operation, or design. Exposure to physical layout and circuit floorplanning for high‑speed analog blocks. Strong analytical and problem‑solving skills applied to complex mixed‑signal systems. Experience supporting multi‑functional silicon build, validation, or characterization activities. Job Profile(s): Semiconductor Design Engineer 3 Relocation Level: TBD Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology, Inc