Signal Integrity Architect

Signal Integrity Architect

Qualcomm Data Center team is developing high performance, energy efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work!

We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

Key Responsibilities

• Collaborate with SoC, applications engineering, packaging, and system design teams to define and implement system interconnects that meet the unique demands of high-end server environments.
• Provide guidelines and feedback on silicon timing, bump/RDL, package pinout and PCB specifications.
• Develop customer guidelines and define module interfaces/formats for simulation.
• Lead the creation of server-grade SI models, simulations, and final designs.
• Perform early SI analysis on 2.5D/3D structures and establish design guidelines.
• Update and automate design and analysis flows.
• Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers.

Minimum Qualifications

• Master's degree in Electrical or Computer Engineering, with a specialization in Signal Integrity (SI).
• 6+ years of experience in SI analysis, simulation, and measurement of high-speed digital systems.
• Strong knowledge of SI fundamentals, including power distribution networks (PDN), EMIR, transmission line theory, crosstalk, S-parameters, and channel simulations.
• Expertise in DDR5/LPDDR5X JEDEC specifications and/or SerDes standards (PCIe, CXL, USB, Ethernet, etc.).
• Experience in developing SI methodologies from die to system, with lab correlation and validation.
• Proficiency with 2D/2.5D/3D EM simulation tools such as ANSYS HFSS Cadence Sigrity, Dassault Systèmes CST, Keysight ADS, and Synopsys' HSPICE.
• Hands-on experience creating complex SI models and performing both frequency and time-domain simulations.
• Proficiency in Unix/Linux environments and experience with EDA tools through scripting.
• Strong knowledge of packaging and PCB technologies, design, and manufacturing processes.
• Familiarity with 2.5D/3D packaging technologies, such as CoWoS, InFo, EMIB, and RDL.
• Hands-on experience with electrical validation and compliance testing using tools like VNAs, oscilloscopes, spectrum analyzers, PCIe/I2C analyzers, traffic generators, TDR, and differential probes.
• Proven ability to work independently and collaboratively within a cross-functional team environment.
• Strong technical documentation skills and excellent written and verbal communication.

Pay range and Other Compensation & Benefits :

$220,200.00 - $330,400.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.