Field Applications Engineer, High Speed Interconnect
T1Nexus
Field Applications Engineer – High-Speed Interconnect
T1Nexus | Fremont, CA (hybrid)
About T1Nexus
T1Nexus is a leading provider of advanced networking solutions, delivering state-of-the-art optical transceivers and cables designed to meet the demands of AI-driven cloud platforms. We are committed to innovation and excellence, driving the future of networking technology.
About The Role
T1Nexus is looking for a technically sharp Customer Solutions Engineer to bridge the gap between our customers and our product and engineering teams. You’ll be a trusted advisor to the companies building and scaling next-generation AI infrastructure, hyperscale data centers, and high-performance computing environments — guiding them from initial evaluation through full production deployment of our optical interconnect portfolio.
This is a remote-based role with travel to customer sites, labs, and industry events across North America as needed.
What You'll Do
Own the Technical Relationship
- Act as the go-to technical resource throughout the customer lifecycle — from proof-of-concept through qualification, deployment, and ongoing support.
- Build lasting partnerships with OEMs, ODMs, switch platform vendors, NeoClouds, HPC facilities, and enterprise AI infrastructure teams.
- Lead technical presentations, solution workshops, and product demonstrations tailored to customer architecture requirements.
- Participate in industry conferences, customer reviews, and strategic meetings alongside the sales team.
Drive Successful Deployments
- Support customer lab bring-up, interoperability testing, and system validation from initial integration through production rollout.
- Provide hands-on lab and onsite support during critical qualification phases.
- Help customers select the right interconnect solution by analyzing reach, power budget, latency, and deployment constraints.
- Contribute to lab infrastructure maintenance supporting customer evaluation and testing activities.
Solve Hard Problems
- Diagnose and resolve complex issues spanning hardware, firmware, signal integrity, and optical link performance in live customer environments.
- Lead escalation coordination across internal engineering, quality, operations, and supply chain teams to drive fast resolution.
- Deliver actionable feedback to product and engineering on performance gaps, feature priorities, and emerging market requirements.
Develop and Share Expertise
- Contribute to technical collateral including application notes, deployment guides, and integration references.
- Maintain current knowledge of evolving AI cluster networking topologies and GPU fabric architectures.
Technical Focus Areas
- Optical transceivers: 400G, 800G, and 1.6T form factors
- Cable solutions: Active Electrical Cables (AEC), Direct Attach Copper (DAC), and Active Copper Cables (ACC)
- Optical architectures: Linear optics and DSP-based transceiver technologies
- Protocols: Ethernet and InfiniBand interconnects
- Compute platforms: NVIDIA QM, ConnectX, and Spectrum product families; Ethernet switching and AI fabric platforms; hyperscale and enterprise server environments
- Signal integrity: PAM4 modulation, DSP architecture fundamentals, optical link budget analysis
- Infrastructure: Fiber plant design, AI cluster topologies, GPU interconnect fabrics
What You Bring
Required
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Photonics, or a related field
- 5+ years of experience in optical transceivers, high-speed interconnect technologies, or data center networking
- Proven hands-on work with 400G/800G optical products, NVIDIA networking platforms, and lab validation tooling
- Customer-facing experience managing technical evaluations, troubleshooting escalations, and production deployments
- Strong communicator — equally comfortable in the lab and in front of a customer executive team
- Willingness to travel across North America for customer support and industry engagements
Preferred
- Direct experience supporting NeoCloud, enterprise AI, or HPC infrastructure customers
- Familiarity with DSP silicon platforms from vendors such as Marvell, Broadcom, or Credo
- Exposure to silicon photonics or co-packaged optics development and deployment
- Working knowledge of AI cluster networking architectures and GPU infrastructure at scale
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