Sales Application Engineer (Business Development - Semiconductor)

TITLE: Sales Application Engineer – Semiconductor Business Development

REPORTS TO: Global Director of Sales & Marketing

JOB GRADE: Salary

TOTAL OTE COMP: $125,000 - $160,000

BASE: $120,000 - $130,000 + uncapped commission

LOCATION: 100% remote

TRAVEL: Up to 50% (National and International)

About Darmann

Since 1983, Darmann has been revolutionizing the abrasive products industry through innovation that improves manufacturing precision and productivity. We specialize in fine grit abrasive stones known for unmatched quality, consistency, and performance, supporting customers across highly technical industries including automotive, aerospace, medical implants, and semiconductors.

Darmann is an employee-owned organization committed to solving the industry’s most complex challenges through collaboration and shared accountability. As part of our ESOP (Employee Stock Ownership Plan), employees have the opportunity to build long-term financial value and contribute directly to the company’s success. We prioritize a high-performance environment where continuous improvement, ownership, and mutual respect are expected and reinforced.

Job Overview

The Sales Application Engineer – Semiconductor Business Development is responsible for driving new business opportunities, supporting customer evaluations, and expanding Darmann's semiconductor business. This role combines technical application engineering, strategic business development, and account management while working closely with customers, engineering, R&D, and operations.

The successful candidate will develop relationships with semiconductor manufacturers, foundries, OSATs, and equipment manufacturers while providing technical expertise to support product evaluations, process optimization, and commercial growth.

Key Responsibilities

• Develop and grow strategic semiconductor accounts across North America.
• Identify new opportunities with semiconductor manufacturers, wafer fabricators, foundries, IDMS, OSATs, and semiconductor equipment manufacturers.
• Lead technical sales presentations, customer evaluations, and product qualification activities.
• Provide application support for wafer grinding, thinning, dicing, dressing boards, grinding wheels, and related precision abrasive applications.
• Build relationships with Engineering, Manufacturing, Procurement, and Executive leadership.
• Coordinate customer trials and collaborate with R&D on new product development.
• Maintain customer opportunities, forecasts, and activities within the CRM system.
• Represent Darmann at customer visits, trade shows, conferences, and industry events.
• Travel throughout the assigned territory to support customers and business development initiatives.
• Perform other duties and strategic projects as assigned.

Requirements

• 8–10 years of technical sales, application engineering, or business development experience within the semiconductor industry.
• Working knowledge of Front-End and Back-End semiconductor manufacturing, Advanced Packaging, Silicon and SiC wafer processing.
• Strong communication, presentation, and customer relationship management skills.
• Proficiency with CRM systems (HubSpot preferred).
• Bachelor’s degree in engineering

Preferred

• Experience with wafer grinding, thinning, dicing, and related precision abrasive applications.
• Knowledge of abrasive products or semiconductor consumables.
• Master’s degree in engineering

Benefits

• Comprehensive benefits package including
• Medical, dental, vision
• 401(k) with match
• Employee Stock Ownership Plan (eligibility requirements apply)
• Paid Time Off, Sick Leave, and 10 paid holidays
• STD, LTD, EAP, FSA, HRA and more

EQUAL OPPORTUNITY EMPLOYER

Darmann provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.