Digital Failure Analysis Engineer (R&D)

About the job:As an Electrical Failure Analysis (EFA) Engineer, you will perform various electrical investigative work on defect, performance and design-related issues during the technology development phase pertaining to a broad range of products in order to deliver qual-capable and high-yielding devices. This position also requires the ability to develop testing algorithms to successfully segment various electrical failures. You will also be adhering to all lab safety guidelines.Key Responsibilities:Failure Data Analysis and Diagnosis: Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.Electrical Failure Analysis: Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.Cross-Functional Debug and Physical Correlation: Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.Why TI?Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TIBenefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits hereAbout Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.Minimum requirements:Bachelor's degree in Electrical Engineering or Electrical and Computer Engineering5+ years of experience performing electrical failure analysis on semiconductor devicesPreferred Qualifications:Strong understanding of semiconductor fabrication processesExcellent technical, communication, and analytical skillsExperience in interpreting SEM/TEM/FIB/EDS/EELS images and analysis resultsExperience in interpreting scan test data and shmoosFamiliarity with digital circuit operation and scan-based test methodologiesExperience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentationExperience with digital IC design, mixed-signal IC design, or related design environmentsFamiliarity with memory mapping tools, ATPG diagnostics like Cadence Modus and Synopsys Tetramax and Avalon layoutsAbility to work collaboratively across engineering teams including design, test, failure analysis, and manufacturing/process development groupsFull timePosting Date: 2026-07-16