Thin Films Module Development Engineer

Job Details:Job Description: Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.Core Responsibilities:Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platformsDesign, implement, and optimize processes to meet specifications for materials, device performance, yield, and process controlDesign, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvementApply expert knowledge of equipment operating principles, materials characterization and metrology, and device characteristics to accelerate technology development learning cyclesSupport novel material and process screening and evaluation, equipment selection, on-time install/qualification of first-of-kind equipment, and design for manufacturabilityPartner with cross-functional teams including process integration, device engineering, metrology, yield, manufacturing, and equipment suppliersContribute to process pathfinding efforts for next-generation semiconductor technologies through evaluation of novel materials, hardware assessment, process screening, integration development, and silicon validationQualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Minimum Qualifications: PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM fieldWith at least 1+ years of experience in:Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologiesDemonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental designPreferred Qualifications:Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/platingExperience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniquesExperience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentalsProficient with data analysis software including JMP, Excel, Python, R, SQLStrong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environmentExperience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgementStrong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholdersAvailability to work on site and support 24/7 manufacturing operations with on-call rotationFor information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship InformationJob Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Oregon, HillsboroType: Full time