RFIC Thermal Engineer

Job Description

Job Description

Are you passionate about solving complex thermal challenges in advanced semiconductor technologies? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver next-generation wireless solutions that maximize performance while improving efficiency and reliability.

Falcomm is seeking an RFIC Thermal Engineer to analyze, model, and optimize thermal performance in RF integrated circuits and semiconductor packages. This role will focus on understanding heat dissipation, thermal reliability, and thermal management strategies for high-power RF devices. The position requires collaboration with RFIC designers, packaging engineers, and system teams to ensure devices operate reliably under demanding performance conditions.

Responsibilities:

• Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution.

• Perform thermal simulations and analysis to support design optimization and reliability improvements.
• Collaborate with RFIC design and packaging teams to develop thermal management strategies.
• Evaluate thermal performance across different packaging technologies and materials.
• Support silicon validation and characterization related to thermal performance.
• Analyze thermal failure mechanisms and recommend design or process improvements.
• Document analysis methods, results, and recommendations.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.
• 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems.
• Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs.
• Must be willing to work full-time, onsite, in Atlanta, GA.

Preferred Skills:

• Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms.
• Familiarity with semiconductor packaging technologies and thermal interface materials.
• Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs.
• Strong analytical and problem-solving skills with the ability to collaborate across engineering teams.

Benefits

• Competitive Salary and Equity Package

• Comprehensive Health, Dental, and Vision Insurance
• 401(k) Retirement Plan
• Paid Time Off (PTO) and Sick Leave

Disclosure:

• Falcomm is an Equal Opportunity Employer; employment with Falcomm is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
• Applicants wishing to view a copy of Falcomm’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify Falcomm.
• To conform to U.S. Government export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State.