Lead Field Application Engineer

Our client, a global leader in materials solutions for advanced electronics, is seeking a highly skilled Lead Field Application Engineer to join their Technology team within the Advanced Flex Technologies (AFT) group in Sunnyvale, CA. This role is dedicated to developing advanced material solutions that enable business growth in high-speed, high-frequency, and power integrity electronic applications. The successful candidate will lead applications engineering for next-generation PCB and advanced packaging technologies, collaborating closely with OEM customers and internal teams to deliver solutions from concept through commercialization. The position emphasizes design and simulation work to integrate advanced materials into cutting-edge customer platforms.

Primary Responsibilities include, but not limited to:

• Lead applications development for advanced flex and rigid PCB materials.
• Support AFT group initiatives by enabling material solutions that drive business growth.
• Engage with OEM customers and the value chain in consumer electronics and data center sectors to define requirements and deliver design-phase solutions.
• Collaborate closely with the business team to assess new opportunities and identify emerging technology trends.
• Design, simulate, and characterize radio frequency (RF) and signal integrity (SI) test vehicles using industry-standard tools.
• Partner with the leveraged RF/SI characterization team in Sunnyvale, providing technical leadership and guidance on characterization activities, including operation of VNAs (up to 120 GHz), TDRs, impedance analyzers, and RF probe stations.
• Perform electromagnetic (EM) simulations using Keysight ADS, COMSOL, HFSS, Sonnet, and other modeling tools.
• Develop and implement IPC-compliant characterization methodologies.
• Partner with internal teams and external PCB fabricators to transition technologies from proof-of-concept to mass production.
• Represent the client in industry consortiums and conferences.
• Deliver technical training and seminars to internal teams and external partners.
• Mentor junior engineers and contribute to their technical and professional development.

REQUIRED SKILLS AND EXPERIENCE

• M.Sc. in Electrical Engineering or closely related field, with 15+ years of relevant experience preferred.
• Demonstrated expertise in RF and signal integrity design, simulation, and characterization.
• Proficiency in tools such as Keysight ADS, HFSS, COMSOL, Polar Si9000, Sonnet, AutoCAD, MATLAB, LabVIEW, JMP.
• Strong analytical, communication, and interpersonal skills.
• Proven track record of successful customer engagement and project leadership.
• Experience with IPC standards and industry best practices.
• Able and willing to travel, typically up to 20%, as required.

NICE TO HAVE SKILLS

• Ph.D. in Electrical Engineering or closely related field, and 10+ years of relevant experience in applications engineering, PCB design, or advanced packaging technologies preferred.

COMPENSATION:

$200-250k. Exact compensation may vary based on several factors, including skills, experience, and education.