Semiconductor Process Engineer - CMP, Photolithography, or PECVD

Job Description

Job Description

Position Title:  Semiconductor Process Engineer - CMP, Photolithography, or PECV

Location: Odon, IN

Job Type: Permanent, Full-time, Onsite

Division: NHanced 

About Us

Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offers unique capabilities in high-performance computing, artificial intelligence, cybersecurity, and remote sensing applications.

Position Summary

We are hiring Process Engineers to support a growing 200mm silicon interposer manufacturing operation. Opportunities are available in three process areas: chemical mechanical planarization (CMP), photolithography, and plasma-enhanced chemical vapor deposition (PECVD).

Candidates should have experience in at least one of these areas. Experience across all three is not required. Each engineer will have primary responsibility for their assigned process area and will work with equipment, integration, and manufacturing teams to establish reliable processes.

These positions involve hands-on process development, qualification, troubleshooting, and manufacturing support in a low-volume fab startup environment.

General Responsibilities

• Develop, qualify, and maintain processes within the assigned area.
• Establish process recipes, operating windows, and acceptance criteria based on product requirements.
• Plan and execute experiments to evaluate materials, process settings, and equipment performance.
• Analyze inspection and metrology data to identify sources of variation and improve process performance.
• Investigate defects and process excursions, determine root causes, and implement corrective actions.
• Support equipment installation, acceptance, and process qualification in coordination with equipment engineers and vendors.
• Work with process integration and adjacent process teams to address compatibility between fabrication steps.
• Write and maintain process specifications, operating procedures, qualification reports, and engineering records.
• Train technicians and operators on process execution and troubleshooting.
• Follow cleanroom, chemical handling, and equipment safety procedures.

CMP Process Engineering

Engineers in this role will develop and support planarization processes for interposer fabrication. Responsibilities include:

• Develop polishing recipes for dielectric and/or metal films, including selection and evaluation of slurries, pads, and conditioning parameters.
• Establish removal rates, uniformity, and process repeatability while controlling dishing, erosion, scratches, and other polishing defects.
• Develop and optimize post-CMP cleaning processes to control particles and residues.
• Evaluate film thickness, surface condition, and topography before and after polishing.
• Investigate process changes associated with consumable condition, equipment performance, and incoming wafer variation.

Relevant experience includes CMP process development or manufacturing support, polishing consumables, post-CMP cleaning, and associated metrology. Experience with either dielectric or metal CMP is applicable.

Photolithography Process Engineering

Engineers in this role will develop and support patterning processes using i-line steppers and contact aligners. Responsibilities include:

• Develop processes for wafer preparation, photoresist coating, baking, alignment, exposure, and development.
• Establish process windows that meet feature dimension, overlay, resist profile, and defect requirements.
• Create and maintain exposure recipes and alignment strategies.
• Evaluate photoresists and process compatibility with subsequent etching, deposition, or plating steps.
• Troubleshoot adhesion problems, dimensional variation, alignment errors, incomplete development, and other patterning defects.

Relevant experience includes photolithography process development or manufacturing support using any exposure technology. Previous experience with i-line steppers or contact aligners is preferred but is not required.

PECVD Process Engineering

Engineers in this role will develop and support dielectric film deposition processes. Responsibilities include:

• Develop and qualify PECVD recipes for silicon dioxide, silicon nitride, and related dielectric films.
• Establish process windows for film thickness, uniformity, stress, refractive index, and other properties required by the application.
• Evaluate the effects of deposition conditions on wafer bow, film adhesion, and compatibility with subsequent processing.
• Investigate particles, film defects, process drift, and chamber-related variation.
• Establish chamber conditioning and cleaning requirements in coordination with equipment engineers.
• Use film metrology and downstream process results to assess deposition performance.

Relevant experience includes PECVD process development or manufacturing support, dielectric film characterization, and troubleshooting of plasma deposition processes.

Required Qualifications

• Bachelor’s degree in engineering, materials science, physics, chemistry, or a related technical field, or equivalent relevant experience.
• At least 3 years of hands-on semiconductor process engineering experience in CMP, photolithography, or PECVD . Candidates with 3–5 years or more are encouraged to apply.
• Practical understanding of process development, qualification, and troubleshooting within the candidate’s area of expertise.
• Experience planning experiments, analyzing data, and using inspection or metrology results to make process decisions.
• Ability to document technical work clearly and translate results into usable manufacturing procedures.
• Ability to work independently while collaborating with engineers, technicians, and equipment suppliers.
• Willingness to perform hands-on work in a cleanroom environment.

Preferred Qualifications

• Experience with 200 mm wafer processing, silicon interposers, advanced packaging, MEMS, or related technologies.
• Experience supporting a new fabrication line, process transfer, or transition from development to manufacturing.
• Familiarity with statistical process control, measurement system analysis, and structured root-cause investigation.
• Experience coordinating with equipment vendors on process capability and qualification.

Work Environment

These are on-site positions involving regular work in a cleanroom and use of required protective clothing. Engineers will work with process equipment and materials under established safety procedures.

Application Guidance

Please indicate your primary area of interest— CMP, Photolithography, or PECVD —and describe your relevant process experience. Applicants will be considered for the role that best matches their background.

Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.