Implant Process Engineer

Job Description As an HIVAC Engineer, you will serve as a technical cornerstone for our semiconductor manufacturing operations, driving the research, development, and long-term sustainability of ion implantation, epitaxial growth processes, and metrology technologies. You will leverage a deep understanding of scientific and engineering principles to solve complex technical challenges, utilizing data analysis to ensure process stability, equipment qualification, and continuous improvement. This role requires a highly skilled troubleshooter capable of addressing electrical and process-related issues across CMOS, Bipolar, and BiCMOS technologies, with proficiency in analytical tools such as JMP, Excel, and PROMIS. This Job Is For You If You have technical experience with Axcelis ion implanter platforms, including 8200P, NV-GSD-180, NV-GSD HE, LED, and Purion systems. You have experience with epitaxial (EPI) growth tools and related process technologies. You have experience developing and sustaining 0.35 m to 0.13 m RFCMOS and SiGe BiCMOS processes. You possess a strong understanding of Statistical Process Control (SPC) and its practical application in semiconductor manufacturing. You can work closely with device, integration, and yield engineers in a matrixed organization to drive advanced process module development, process control, and continuous improvement. You can investigate and verify issues reported by Yield Engineering and evaluate equipment-induced process impacts. You can collaborate with Process Technicians to address daily manufacturing issues, prioritize activities, and resolve held-lot situations. You can develop and implement process improvements, including variable DCOPs and implant recipe optimization. You can analyze E-test data, disposition non-conforming wafers and lots, apply SPC methodologies to improve yield, and recommend corrective actions to resolve E-test issues. You can utilize advanced analytical tools and methodologies to solve wafer fabrication challenges. You can actively participate in cross-functional teams to resolve technical manufacturing issues. You can develop and maintain implant operation procedures, specifications, and technical documentation. You can develop tools and methodologies to enhance failure analysis capabilities. You can evaluate and recommend capital equipment investments to improve analytical and process capabilities. Job Requirements Bachelor's degree in Chemistry, Materials Science, Electrical Engineering, Physics or a related field required; Master's degree or Ph.D. strongly preferred. Minimum of 1-5+ years of hands‑on experience operating, maintaining, or supporting Axcelis ion implantation platforms, including 8200P, NV-GSD-180, NV-GSD HE, LED, or Purion systems. Minimum of 1-5+ years of hands‑on experience with silicon‑germanium (SiGe) epitaxial growth processes and EPI equipment. Demonstrated proficiency in Bipolar, CMOS, BiCMOS, or related semiconductor fabrication technologies, including process characterization and device performance evaluation. Proven analytical and problem‑solving skills, including root‑cause analysis and implementation of data‑driven process improvements. Strong communication skills with the ability to present complex technical findings to cross‑functional teams and management through effective data visualization and technical documentation. Compensation: $100,000 - $153,000 #J-18808-Ljbffr Tower Semiconductor