Director / Sr. Director of Engineering - Advanced Packaging

About Thintronics

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Thintronics is solving one of the defining challenges in modern computing: moving massive amounts of data and power between chips at unprecedented speeds and densities.

As Moore's Law slows, performance is increasingly defined by advanced packaging, chiplet architectures, and high-density substrates. Thintronics has developed breakthrough dielectric materials that enable unprecedented interconnect density, signal integrity, and power delivery for next generation semiconductor packages.

Our technology spans chemistry, materials science, semiconductor processing, and electrical engineering, creating new possibilities for AI accelerators, high-performance computing, advanced networking, and 5G/6G infrastructure. We partner with leading semiconductor companies, including integrated device manufacturers (IDMs), foundries, substrate manufacturers, and outsourced assembly and testing (OSAT) partners, to help shape the future of advanced packaging.

Joining Thintronics means joining a small, highly accomplished team where technical excellence, curiosity, and innovation drive everything we do.

About the Role

Thintronics is seeking an exceptional Director / Sr Director of Engineering, Advanced Packaging to lead the integration of our breakthrough materials into the world's most advanced semiconductor packaging platforms.

Reporting directly to the Chief Technology Officer, this individual will define and execute Thintronics' advanced packaging strategy, serving as the technical leader responsible for translating cutting edge materials innovation into manufacturable, high volume semiconductor solutions.

This is a highly strategic and hands-on leadership role requiring deep expertise in advanced packaging, semiconductor process integration, customer engagement, and cross functional technical leadership. The successful candidate will work closely with customers, manufacturing partners, and internal R&D teams to accelerate commercialization while helping build Thintronics' packaging organization for future growth.

This role carries equal responsibility for the direct management of Thintronics' engineering organization, including the Process Integration team, Substrate Manufacturer and OSAT Engagement, and the Electrical Engineering, ECAD, Mechanical Engineering, and Reliability functions.

This position offers a rare opportunity to influence product strategy, customer success, and the future direction of one of the semiconductor industry's most promising materials technology companies.

What You'll Do

Technical Leadership

• Define and lead Thintronics' advanced semiconductor packaging strategy.
• Develop technology roadmaps for integrating Thintronics' dielectric materials into next generation package architectures.
• Drive process integration strategies that maximize electrical performance, manufacturability, reliability, and yield.
• Identify technical risks and develop mitigation strategies throughout product development and customer qualification.

Customer & Partner Engagement

• Serve as the senior technical interface for strategic customers and development partners.
• Lead technical reviews with leading semiconductor manufacturers, foundries, OSATs, substrate suppliers, and ecosystem partners.
• Support customer evaluations, qualifications, and production ramps.
• Represent Thintronics at executive level technical discussions and industry conferences.

Process Integration

• Lead development and optimization of advanced packaging integration flows.
• Guide process development across dielectric deposition, patterning, metallization, via formation, reliability testing, and package integration.
• Drive Design of Experiments (DOE), root cause analysis, process characterization, and yield improvement initiatives.
• Establish best practices for process control, manufacturability, and reliability.

Product Development

• Collaborate closely with Chemistry, Materials Science, Device Engineering, Reliability, Manufacturing, and Applications Engineering teams.
• Translate customer requirements into product specifications and future technology development.
• Help prioritize R&D investments based on customer needs and market opportunities.

Organizational Leadership

• Build and mentor a world class Advanced Packaging engineering organization, with direct management responsibility across Process Integration, Substrate Manufacturer & OSAT Engagement, Electrical Engineering, ECAD, Mechanical Engineering, and Reliability.
• Recruit, develop, and coach high performing engineers.
• Establish technical standards, engineering processes, and best practices.
• Foster a culture of innovation, collaboration, and continuous improvement.

Strategic Leadership

• Contribute to Thintronics' long term technology and commercialization strategy.
• Support technical due diligence with customers, investors, and strategic partners.
• Evaluate emerging semiconductor packaging technologies and competitive developments.
• Work closely with executive leadership to identify future market opportunities.

What We're Looking For

Required Qualifications

• Ph.D. or M.S. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline.
• 12+ years of experience in semiconductor packaging, process integration, or advanced packaging technologies.
• Demonstrated technical leadership in advanced semiconductor packaging within a leading semiconductor manufacturer, substrate supplier, OSAT, equipment company, or materials company.
• Deep expertise in semiconductor package development, process integration, and manufacturing.
• Experience leading multidisciplinary engineering teams and cross functional technical programs.
• Prior experience directly managing a team of direct reports, with a demonstrated track record of hiring, developing, and leading engineering staff.
• Working knowledge of electrical engineering fundamentals, including signal integrity and power integrity design trade offs, as they relate to advanced package design and integration.
• Familiarity with design for manufacturability (DFM), design rule check (DRC), and other ECAD/mechanical design verification practices used in package development.
• Strong customer facing experience supporting technology development and commercialization.
• Exceptional analytical, communication, and leadership skills.
• Demonstrated ability to thrive in a fast paced, entrepreneurial environment.

Preferred Qualifications

Experience in several of the following areas is highly desirable:

• Advanced packaging (2.1D/2.5D/3D Heterogeneous integration)
• Chiplet architectures
• Redistribution Layers (RDL) and Interposer technologies
• Standard build-up film and inter-layer dielectrics (ILD)
• Package reliability validation and testing
• Process integration (semi-additive, additive, embedded trench, damascene)
• Design of Experiments (DOE) and Statistical Process Control (SPC)
• Customer qualification and technology transfer

Experience working with one or more of the following is particularly valuable:

• Leading semiconductor manufacturers
• Advanced substrate manufacturers
• OSATs
• Semiconductor materials suppliers
• Semiconductor equipment companies

Why This Role Matters

This is one of the most strategically important technical leadership positions within Thintronics.

The Director / Sr Director of Engineering, Advanced Packaging will play a central role in determining how our breakthrough materials become commercial products adopted by the world's leading semiconductor companies. Success in this position will directly influence customer adoption, product commercialization, intellectual property development, and the long-term growth of the company.

For the right individual, this represents a rare opportunity to help shape the future of semiconductor packaging while building a new technical organization from the ground up.

Compensation & Benefits

Thintronics offers a highly competitive compensation package designed to reward both immediate impact and long-term value creation. The anticipated base salary range for this position is $165,000 to $240,000 , depending on experience, qualifications, and demonstrated expertise. As an early leader in a rapidly growing deep technology company, this role also offers meaningful long term equity upside and the opportunity to help build a transformative semiconductor business.

In addition to base salary, this position is eligible for:

• Participation in the Thintronics Stock Option Plan, subject to Board approval
• Comprehensive medical, dental, and vision insurance
• 401(k) retirement plan
• Unlimited paid time off
• Paid company holidays
• Professional development opportunities

Actual compensation will be determined based on the selected candidate's experience, technical expertise, leadership background, and overall fit for the role. xhyhwjd

Thintronics is an equal opportunity employer. We do not discriminate on the basis of race, color, religion, sex, national origin, age, disability, veteran status, or any other characteristic protected by applicable law.