Thermal & Packaging Engineer, Semiconductors
Intel Corporation
Intel Corporation is seeking a Semiconductor Research Engineer in Arizona to drive experimental device physics, packaging concepts, and materials science innovations. You will design, simulate, and fabricate prototypes, then test them across DC and RF domains to validate performance and reliability. You will collaborate with cross‑functional teams, develop DOE methodologies, and mentor others while advancing assembly and packaging platform technologies for next‑gen devices at Intel. #J-18808-Ljbffr Intel Corporation
Vacancy posted 4 days ago
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