IC Packaging Design Engineer - Substrate & High-Speed

CORE Occupational Medicine seeks an experienced IC Packaging Design Engineer for a 12+ month long-term contract. Location options include Chandler, AZ or Hillsboro, OR, onsite only. The candidate will lead substrate design and high-speed layout for advanced packaging, collaborating closely with SI/PI, mechanical, and manufacturing teams. Ideal candidates have deep hands-on experience with Siemens Xpedition (XPD) or Cadence Allegro APD/SiP and a strong grasp of DRC, design for performance, #J-18808-Ljbffr CORE Occupational Medicine