IC Packaging Design Engineer - Substrate & High-Speed
CORE Occupational Medicine
CORE Occupational Medicine seeks an experienced IC Packaging Design Engineer for a 12+ month long-term contract. Location options include Chandler, AZ or Hillsboro, OR, onsite only. The candidate will lead substrate design and high-speed layout for advanced packaging, collaborating closely with SI/PI, mechanical, and manufacturing teams. Ideal candidates have deep hands-on experience with Siemens Xpedition (XPD) or Cadence Allegro APD/SiP and a strong grasp of DRC, design for performance, #J-18808-Ljbffr CORE Occupational Medicine
Vacancy posted 4 days ago
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