Senior Thermal Engineer

Job ID: 200054245Posted: 2026-09-10Location: United States, Washington, RedmondSalary: USD $119,800 - $234,700 per yearEmployment type: Full-TimeWork site: 3 days / week in-officeRole type: Individual ContributorTravel: Less than 25%Profession: Hardware EngineeringDiscipline: Hardware EngineeringCompany: MicrosoftOverviewMicrosoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission. Team-specific overview instruction: We are looking for a Senior Thermal Engineer to focus on the thermal hardware design of Azure servers and related components at the server and rack level. A strong mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop thermal hardware to effectively manage high performance data center devices. You will work with internal and external partners, focusing on delivering the next generation of world class data center hardware. The Senior Thermal Engineer's mission is to provide thermal engineering expertise to AHSI programs and create impact by achieving reliable, TCO minimized, thermal designs it a timely manner. ResponsibilitiesSupport the full lifecycle of server development, from early-stage design and architecture through validation, qualification, and product release.Apply expertise in server thermal design and analysis to develop robust cooling solutions while accounting for mechanical, electrical, and overall system-level design considerations.Plan, execute, and evaluate server-level thermal, airflow, and liquid-cooling testing to validate performance against defined specifications and requirements.Perform Computational Fluid Dynamics (CFD) modeling and analysis to evaluate thermal performance, airflow behavior, and cooling effectiveness. Experience with FloEFD and/or Flotherm is highly preferred.Develop and review mechanical designs using CAD tools while supporting effective CAD data management and design documentation. Experience with PTC Creo and Windchill is preferred.Partner closely with cross-functional engineering teams and global development partners to communicate technical requirements, resolve design challenges, and drive thermal solutions from concept through production.Develop high-level system concepts, document and evaluate design alternatives, and translate complex engineering analysis into clear recommendations for technical teams and senior leadership.Lead troubleshooting, debugging, root-cause investigation, and failure analysis activities using strong engineering fundamentals and analytical techniques to resolve complex thermal and system-level issues.Provide technical guidance and engineering support to Asia-based development partners throughout design, validation, and build activities.Communicate complex technical concepts clearly and effectively through design reviews, technical documentation, presentations, and cross-functional discussions.Support domestic and international travel, as needed, for design reviews, development builds, testing, validation, and other engineering activities.QualificationsRequired Qualifications:Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 5+ years technical engineering experience OR equivalent experience.Other Requirements:Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings:Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. Preferred Qualifications:Minimum BS/MS in Mechanical/Thermal Engineering. MS with focus on thermal sciences preferred. 7+ years of relevant experience in Thermal Engineering across all stages of server development and release cycles.Strong background in thermal design and analysis for servers and related equipment, including heat exchangers.Proven ability to partner with ODMs to develop and deliver thermal solutions that meet technical and performance specifications.Hands-on expertise conducting thermal testing, including the use of airflow test chambers and related test equipment.Demonstrated ownership of programs through the full lifecycle, from initial concept and design through validation and delivery.Cross-functional collaboration with Mechanical Engineering (ME), Electrical Engineering (EE), and Software/Firmware teams to ensure thermal solutions are fully integrated with overall system requirements.#SCHIEHardware Engineering IC4 - The typical base pay range for this role across the U.S. is USD $119,800 - $234,700 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $160,200 - $261,000 per year. Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.