Module Development Engineer

Job Details:Job Description: As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, driving the design and development of advanced manufacturing processes and enabling technologies. Your contributions will shape Intel's ability to deliver cutting-edge devices, enhance production efficiency, and influence the future of semiconductor technology. In this role, you will collaborate with world-class teams and industry-leading suppliers to pioneer materials, equipment, and process integration strategies that push the boundaries of technological possibilities. By joining Intel, you will have the opportunity to make a profound impact on our technology roadmap and help maintain Intel's leadership in a dynamic and competitive marketplace.Key Responsibilities:Develop and optimize advanced manufacturing processes including material selection, parameter adjustments, equipment metrology, and system designConduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmapsDesign and implement modifications to operating equipment to improve efficiency and production outputCollaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processesPerform process technology feasibility studies using theoretical simulations and practical engineering methodsStay informed on industry trends and technological advancements to align manufacturing processes with evolving semiconductor needsDrive the development of cost-sensitive technology roadmaps in partnership with vendors and internal stakeholdersQualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Minimum Qualifications: PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experienceRelevant experience includes, but is not limited to:Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materialsExperience with experimental design, data collection, and statistical analysisAbility to analyze process results and clearly document findings in technical reports and presentationsStrong problem solving skills and ability to work independently while collaborating in cross functional teamsEffective written and verbal communication skills in a technical environmentWillingness to work in a fab or lab environment and follow strict safety and contamination control protocolsPreferred Qualifications:PhD research focus specifically related to plasma etch, pattern transfer, or advanced logic/memory process integrationHands on experience with production or pilot line dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi)Knowledge of advanced node challenges such as high aspect ratio etching, CD control, etch selectivity, and damage mitigationExperience with Design of Experiments (DOE) and statistical process control (SPC)Familiarity with process integration, yield learning, or technology development methodologiesProgramming or scripting experience for data analysis or automation (e.g., Python, MATLAB, JMP, or similar tools)Exposure to foundry or industrial semiconductor Research and Development environments through internships, collaborations, or joint research programsAbility to manage multiple experiments or development tasks in a fast paced, manufacturing driven Research and Development settingDemonstrated interest in transitioning academic research into high volume manufacturing solutionsHands on research experience with dry etch-related topics (e.g., plasma etching, RIE, ICP, ALE) through academic research, dissertation work, or internshipsWorking understanding of semiconductor manufacturing process flows and device structuresFamiliarity with common semiconductor characterization techniques (e.g., SEM, TEM, AFM, XPS, ellipsometry)For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship InformationJob Type:College GradShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Oregon, HillsboroType: Full time