Thermal Mechanical Modeling Engineer

* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)* Voluntary Vision, Dental, Life, and Disability insurance options* Generous paid vacation, sick time, and holidays* Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds* Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)* Flexible spending account options for medical and childcare expenses* Robust free training access through LinkedIn Learning plus professional conference opportunities* Tuition assistance* Expansive employee discount program including athletic tickets* Free access to UT Austin's libraries and museums with staff ID card* Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card* For more details, please see and and* Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.* Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.* Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.* Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains.* Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.* Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.* Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.* Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.* Other related functions as assigned.* BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.* 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.* Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.* Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.* Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.* You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.* Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.* Location. Austin, Texas is required for close collaboration with our engineering teams and partners.* MS or PhD in Electrical Engineering, Applied Physics, or related discipline.* 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.* Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).* Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.* Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.* Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.* Demonstrated experience creating and validating PDK/ADK simulation collateral spanning thermal, and mechanical domains.* Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.**Start Here, Change the World**At The University of Texas at Austin, tradition meets innovation in the heart of a city that frequents lists of the best places to live and work. Named by Forbes as one of America's Best Large Employers for the sixth year in a row in 2025, UT offers both a dynamic work environment and a gateway to vibrant local culture. Whether you're at the forefront of the student experience, conducting world-changing research or supporting the engine that drives Texas’ flagship university, working at UT means making a lasting impact on our city, our state and our world.Our more than 20,000 faculty and staff empower 55,000+ students to challenge ideas, pursue passions and shape their futures. Joining UT, you’ll become part of a community dedicated to making a meaningful impact on campus and throughout the world.Please see our .**Comments and Inquiries:**Email comments to View email address on click.appcast.io. For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: . 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