AI Data Center Power Architect

Location: Fremont, CA Direct Hire - FTE (Onsite) Salary: $220k - $350k per year Power Architect - AI Server & Rack Power Systems Job Summary The Power Architect defines end‑to‑end architecture for power connectors, power whips, and liquid‑cooled busbar systems in AI servers and racks, meeting stringent performance, reliability, safety, and scalability requirements. The role partners with Sales, PLM, and R&D on roadmaps and customer engagements, ensures compliance with IEC/IEEE and thermal/seismic standards, and represents the company in industry consortia (OCP, OIF, IEEE). The architect tracks emerging technologies to boost power density, efficiency, and total cost of ownership. Essential Duties & Responsibilities Design & Optimization: Architect rack/server‑level power distribution (connectors, cables, busbars, whips) for high‑current applications (≈130‑3,000 A), ensuring alignment precision (±1.00 mm), thermal efficiency, serviceability, and reliability in dense GPU/TPU environments (100 kW‑1 MW/rack). Power Estimation & Modeling: Develop and maintain rack/server power estimation tools; lead perf‑vs‑power trade‑offs, Perf/Watt improvements, and early architectural exploration in partnership with hardware/firmware/software teams. Compliance & Standards: Ensure conformity to IEC 61439 and relevant IEEE/safety standards, including seismic, short‑circuit (e.g., 25 kA) and operating temperature requirements (‑40 °C → +125 °C). Cross‑Functional Collaboration: Align product roadmaps with AI infrastructure demands (e.g., NVIDIA/AMD/Intel GPU power envelopes) and customer requirements; support SEs and Sales with reference architectures and TAM/SOW inputs. Innovation & Trends: Integrate liquid‑cooled busbars, low‑GWP cooling, advanced copper alloys, and novel connector systems to elevate power density, efficiency, and maintainability. Industry Engagement: Contribute to/lead workstreams in OCP, OIF, and IEEE; leverage open standards and reference designs for faster qualification and deployment. Required Qualifications Education: Bachelor’s in Electrical Engineering, Mechanical Engineering, Power Systems, or related field. Experience: 10-15 years in power architecture for high‑density systems (rack‑scale 100 kW‑1 MW), ideally in AI/ML or HPC data centers. Technical Depth: Power connector/busbar design (liquid‑cooled, solder‑tail, screw‑mount) and high‑current distribution up to ~3,000 A. Thermal management for AI workloads (air/liquid), pressure drop/flow considerations, and interface materials. Proficiency with IEC/IEEE standards, short‑circuit withstand/coordination, creepage/clearance, and protection schemes. CAD/CAE and simulation (electro‑thermal, CFD, FEA) and system‑level validation/qualification (e.g., 25 kA SCCR). Ecosystem Collaboration: Experience working with OEMs, hyperscalers, and chip vendors (NVIDIA, AMD, Intel) and data center operators on rack/server power delivery. Communication: Ability to translate complex trade‑offs to executives, customers, and engineering teams. Preferred Qualifications Master's/Ph.D. in Power Mechanics, Thermal Engineering, Applied Physics, or related field. Knowledge of BBU/powershelf architectures, dynamic workload/power capping, and rack‑scale controls. Familiarity with AI reference architectures (e.g., designs supporting ~132 kW per rack and beyond), OCP Open Rack/ORV3 trends, and liquid cooling ecosystems. Experience with reliability engineering (HALT/HASS), DFMEA/PFMEA, and design for manufacturability/assembly (DFM/DFA). Core Competencies System‑level thinking; strong electro‑thermal intuition Data‑driven decision making; modeling and sensitivity analysis Standards and compliance rigor; safety‑first mindset Customer advocacy and roadmap ownership Clear documentation and presentation Success Metrics (First 12 Months) Release of validated reference power architecture(s) meeting target Perf/Watt and cost goals Qualification of high‑current connector/busbar solutions with required SCCR and thermal margins Adoption by at least one strategic customer/platform; measurable reduction in integration time Contributions to OCP/OIF/IEEE deliverables or workstreams Location/Travel Moderate travel to customer sites, labs, vendors, and industry events as needed. Desired Skills and Experience Manufacturing, Cable Assembly, Data Center, Power, Engineering, Hardware, Architecture All qualified applicants will receive consideration for employment without regard to race, color, national origin, age, ancestry, religion, sex, sexual orientation, gender identity, gender expression, marital status, disability, medical condition, genetic information, pregnancy, or military or veteran status. We consider all qualified applicants, including those with criminal histories, in a manner consistent with state and local laws, including the California Fair Chance Act, City of Los Angeles' Fair Chance Initiative for Hiring Ordinance, and Los Angeles County Fair Chance Ordinance. #J-18808-Ljbffr Ledgent Technology