Staff/Senior Staff Power Integrity Engineer - Power Delivery

About Us Powerlattice is a well-funded semiconductor start-up company backed by well-known large Silicon Valley VCs. The company is working on the industry’s groundbreaking chiplet solution for a fundamental shift in how high-performance chips get powered, paving the way for the next generation of AI and advanced computing. About the Role We’re a fast-moving startup building the foundation for next-generation AI compute. We're seeking a highly experienced Staff / Sr. Staff Power Integrity Engineer to lead the architecture, analysis, and optimization of next-generation advanced power delivery chiplet solutions for high-performance computing, AI accelerators, networking, and heterogeneous integration platforms. In this role, you will drive end-to-end power integrity (PI) methodology and execution across silicon, package, interposer, and system domains for advanced multi-die/chiplet architectures. You will collaborate closely with architecture, package, silicon, signal integrity, thermal, CAD, and product engineering teams to deliver robust and scalable power delivery networks (PDNs) for cutting-edge technologies. What You’ll Do Drive chip-package-system co-design for optimal power delivery and decoupling strategies. Lead power integrity architecture and implementation for advanced chiplet-based products and heterogeneous integration platforms. Develop PI design guidelines, methodologies, and signoff criteria for high-current designs. Analyze and optimize high-current delivery paths for AI/HPC workloads based on Powerlattice chiplets. Define and optimize end-to-end PDN solutions across: Die, Package, Interposer and PCB/system Required: Primary Location: Chandler, AZ (preferred). Secondary location: Vancouver, WA. Hybrid 3 days a week onsite in the office What You Bring 8+ years of experience in power integrity and/or signal integrity for high-performance SoCs. Exceptional proficiency in power integrity or signal integrity tool chain and simulation flow. Hands-on experience extracting, building, and validating SoC package electrical models. Strong experience with package-level PI/SI, including substrates, interposers, and advanced packaging (2.5D / 3D). Deep proficiency with PI/SI simulation tools and analysis workflows. Strong debugging skills across simulation and electrical testing environments. High level of professionalism, discretion, and technical judgment. Comfortable working independently and proactively solving problems. Working experience at major processor or ASIC companies in the related technical area. Proven experience as engineering or project lead in a related technical area. Hands-on experience with electrical test methodologies and instrumentation for power integrity or signal integrity. Compensation & Benefits Anticipated annual base salary: $175,000 - $225,000 Stock option grant Comprehensive benefits package including health, dental, vision, and 401(k)