New College Grad - Wafer Bonding Process Development Engineer
1000 Micron Technology, Inc.
Job Responsibilities Develop wafer bonding process to meet physical & electrical requirements of Micron’s products. Optimize wafer bonding processes to reduce cost, process variability, and improve process capability. Collaborate with process integration and other teams to develop innovative solutions. Conduct root cause and failure mode analysis to understand limitations of current hardware and drive vendors for solutions. Perform fundamental research to drive innovative solutions for next‑generation products. Maintain a technology development pilot manufacturing line. Support process transfer to production facilities (may include domestic and/or international travel). Minimum Qualifications Education: MS preferred or BS plus relevant semiconductor experience (required). Majors: Chemical Engineering, Materials Science, or Mechanical Engineering. Ability to resolve complex issues through root‑cause or model‑based problem solving. Working knowledge in statistics, preferably statistical process control. Academic or basic knowledge of wafer bonding process and associated processing within the bonding module. Data science basics / Python coding or programming or scripting desirable. Preferred Qualifications Ability to thrive in a research and development environment. Strong analytical and creative problem‑solving skills. Strong digital literacy, including MS Office. Ability to work independently, with minimal direction, focus on meeting commitments, multitask, and manage multiple projects simultaneously. Benefits Micron offers a range of benefits to support your well‑being and professional growth, including: Choice of medical, dental, and vision plans across all locations. Benefit programs to protect income in case of illness or injury. Paid family leave. Robust paid time‑off program and paid holidays. Equal Opportunity Employment Statement Micron is an equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr
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