AI Automation Design Packaging Lead

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: We are looking for a forward-thinking candidate to drive and lead the team for the development and deployment of next-generation packaging design automation and AI-Driven workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology. THE PERSON: The successful candidate must be a proven leader and a technical innovator who can bridge the gap between physical design requirements and software automation to generate AI driven workflows. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder. KEY RESPONSIBILITIES:

• Drive the development, deployment, and maintenance of AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
• Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
• Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
• Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
• Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
• Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
• Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
• Mentoring junior engineers in coding best practices and advanced packaging concepts.

• Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
• Proven track record of developing automation using Python, Tcl, SKILL, or C++.
• Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
• Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
• Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
• Good leadership and interpersonal skills.

• Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.