Principal Mechanical Design Engineer

Principal Mechanical Design EngineerExperience Level: Professional Job Type: Regular Location: Richardson, TX, US, 75081Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Qorvo is looking for an experienced Principal Mechanical/Thermal Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and analysis efforts of electronics packaging for defense communications, radar and electronic warfare applications.Responsibilities:Principal level Mechanical/Thermal Engineer developing next generation microelectronic packaging technology with emphasis on structural analysisChosen candidate will work closely with select team of IC designers, module designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forwardUsing FEA and other industry standard simulations tools: Perform detailed modeling and optimization of packaging design at the die/package/board levelDevelop and execute thermal and mechanical stress measurement techniques to support analysis for internal and external customersGuide package and substrate design decisions that meet performance specifications and yield requirementsSupervise and respond to manufacturing issues as they occurMaintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trendsSupport external customers with applications models and failure analysis supportQualifications:BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 12 years' experience in semiconductor packagingExperience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industriesExpert level skill with ANSYS and Solidworks, or similarExpert knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologiesExperience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflowKnowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipmentKnowledge of reliability calculation methods for semiconductorsUnderstanding of GD&T, ANSI standards and tolerance stack-ups requiredDemonstrated ability to work with cross-functional teamsExcellent verbal communication and interpersonal skillsExcellent written communications skillsThis position is not eligible for visa sponsorship by the Company. This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).Qorvo is an E-Verify Employer. For more information, please see the Right to Work and E-Verify Participation posters.Nearest Major Market: Dallas Nearest Secondary Market: Fort Worth