Head of Next-Gen Power Silicon & Packaging Innovation

NXP Semiconductors NV

NXP Semiconductors NV seeks a Director of Advanced Power Silicon & Packaging Technology to shape the strategy and execution for next-generation power delivery across silicon, packaging, and system integration. You will partner with design, packaging, manufacturing, and product teams to push power efficiency, density, and reliability in AI, data center, and HPC platforms. The role emphasizes leadership, IP creation, and collaborations with foundries, OSATs, EDA vendors, and research

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Vacancy posted 5 days ago

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