Director / DMTS, Process Integration Lead - Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)
Micron Technology Inc
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities:
- Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
- Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.
- Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation
- Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning
- Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations
- Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 15+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
- Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes
- Experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization
- Experience defining AI-enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development
- Experience leading collaborative technical teams and driving complex engineering programs to completion
- Master's degree or PhD
- Experience developing and scaling advanced packaging technologies from research and development through full-scale manufacturing
- Expertise in yield analysis, statistical process control, defect reduction, and data-driven process optimization
- Experience with warpage modeling, material characterization, and package reliability qualification
- Author or contributor to technical publications, patents, or industry presentations related to advanced packaging technologies
- ...communicate and advance faster than... ...Advanced Packaging Technology Development... ...influence, lead, and mentor... ...in process development,... ..., including HBM, 3DS DRAM, and emerging 3D architectures... ...materials, and integration schemes that... ..., hybrid bonding, TCB, dicing...3DFull timeLocal areaImmediate start
- ...communicate and advance faster than... ...Advanced Packaging Technology... ...and integration technologies... ...Bandwidth Memory (HBM) and other... ...: As a Process Integration... .... You will lead technical projects... ...or PhD and 2+ years of... ..., 2.5D/3D integration... ...microbump, hybrid bonding, or chiplet...3DFull timeLocal areaImmediate startShift work
- ...learn, communicate and advance faster than ever.Department... ...Intro:The Advanced Packaging Technology Development... ...brings together experts in process integration, materials engineering,... ..., including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will...3DFull timeLocal areaImmediate start
- ...communicate and advance faster than... ...Summary The DRAM Packaging organization is... ...industry-leading packaging technologies... ...As the Director of DRAM Packaging... ...technologies, including HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous... ...engineering processes, automation,...3DFull timeLocal areaImmediate start
- ...learn, communicate and advance faster than ever.As... ...conjunction with CIL (Customer Integration Lead), this role requires... ...them with internal HBM design, product... ...engineering, and manufacturing processes (Front-End and Back-... ...solutions, and packaging strategies.Develops and...SuggestedFull timeLocal areaImmediate start
- ...communicate and advance faster than ever.... ...Bandwidth Memory (HBM) technology team!... ...implementation of innovative 2.5D and 3D solutions,... ...electrical and packaging standpoint.... ...Memory, Heterogeneous Integration Group) or... ...-end and backend processes. We develop inventive...3DFull timeLocal areaImmediate start
- ...communicate and advance faster than... ...The Advanced Packaging Technology... ...Bandwidth Memory (HBM) is at the... ...plasma‑based etch processes that enable... ...with process integration and adjacent... ...Trim, and Bonding Perform root... ...as TSV, RDL, hybrid bonding, or 2.5D/3D integration...3DFull timeLocal areaImmediate start
- ...communicate and advance faster than ever... ...Intro:The Advanced Packaging Technology... ...Bandwidth Memory (HBM) is at the center... ...plasma‑based etch processes that enable next... ...with process integration and adjacent process... ...as TSV, RDL, hybrid bonding, or 2.5D/3D integrationProficiency...3DFull timeLocal areaImmediate start
- ...communicate and advance faster than... ...The Advanced Packaging Technology... ...team at Micron leads the creation... ...seamless technology integration. Consult... ...Memory, 2.5D integration... ...and emerging 3D integration... ...strategies including Hybrid bonding (Required) Hands-on process module...3DFull timeLocal areaImmediate start
- ...communicate and advance faster than... ...Advanced Packaging Technology Development... ...at Micron leads the creation... ...technology integration. Consult and... ...Bandwidth Memory, 2.5D... ...and emerging 3D integration strategies... ...including Hybrid bonding (Required)Hands-on process module engineering...3DFull timeLocal areaImmediate start
$119k - $320k
...communicate and advance faster than... ...Principal Signal Integrity Engineer — Interface... ...at the leading edge of that mission... ..., signaling, packaging, and interconnect... ...solvers — Q3D, SIWAVE, HFSS,... ...technologies — 2.5D/3D integration... ...during the hiring process. Please note...3DFull timeLocal areaImmediate start- ...communicate and advance faster than ever... ...Photolithography Process Development... ...to SSDs, MCPs, HBM and other memory... ...a revolutionary 3D DRAM Technology... ...directly with Process Integration and other process... ...capability. Lead a particular module... ...Education: BS + 2 years of...3DFull timeLocal areaImmediate startWorldwide
- ...communicate and advance faster than... ...inside a package that someone... ...and ready to lead at the... ...stack-ups, wire bond and flip chip... ...with Signal Integrity (SI) and Power... ...Integrity 3D-IC, or Siemens... ...— LPDDR, HBM, or GDDR- Experience... ...with 2.5D/3D-IC, Fan... ..., and process/material development...3DFull timeLocal areaImmediate startWorldwide
$105.79k - $141.05k
...are seeking a Senior Lead Technical Marketing... ...solution blueprints, integration patterns, and... ...strategy, positioning, packaging, and activation. Advance partner-led solutions... ...networking, cloud and hybrid architectures, security... ...the selection process. Learn more about...Full timeTemporary workWork from home- ...the team works a hybrid schedule (splitting... ...for ACoS/CoC survey process. Maintain the... ...is proud to be the leading cancer program in... ...and surgeons use advanced technology to provide... ...low-dose CT and 3D imaging, precision... ...radiation therapies, and integrated care plans and...3DRemote jobPart timeLive outWork at officeLocal areaImmediate start
- ...communicate and advance faster than... .... Advanced Packaging Technology Development... ...of 3D memory. We take... ...factory-ready processes, working... ...to-wafer and hybrid bonding. You’ll lead the development... ...products like HBM and 3DS DRAM.... ...materials, and integrations that meet...3DFull timeLocal areaImmediate start
- ...world to learn, communicate and advance faster than ever. Micron... ...information into intelligence. The 3D DRAM Technology Development... ..., collaborating across process development, characterization... ...manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will...3DFull timeInternshipLocal areaImmediate start
- ...communicate and advance faster than ever... ...Photolithography Process Development... ...to SSDs, MCPs, HBM and other memory... ...a revolutionary 3D DRAM Technology... ...directly with Process Integration and other process... ...capability. Lead a particular module... ...Education: BS + 2 years of...3DFull timeLocal areaImmediate startWorldwide
- ...communicate and advance faster than... ...The Advanced Packaging Technology... ...team at Micron leads the creation... ...mechanical wafer processing modules. This... ...with process integration and adjacent... ...including Bonding/De-bonding, CMP... ...field with 2+ years of relevant... ..., or 2.5D/3D integration...3DFull timeLocal areaImmediate start
$80k
...outcomes, operational advancement, scientific... ...capabilities of our Global Integrated Delivery (GID)... ...facilities Develop 3D models and 2D... ...Must have: ~2+ years of BIM design... ...employees with our hybrid working policy, allowing... ...to the recruitment process (for example, you require...3DHourly payRemote work$85.68k - $130.9k
...This position allows for a hybrid work schedule with a mix of work spent... ..., or a high school diploma and 2 or more years drafting course... ...Ability to visualize parts in 3D without the aid of the computer... .... The total compensation package for eligible positions will include...3DHourly payWork at officeLocal areaRemote workWork from homeFlexible hours- ...an Architectural Professional Level 2 or 3 to join our collaborative team... ...design concepts and how they can be integrated into projects. Prepare 2D and 3D design materials for client/project... ...and detail research. May assist or lead the design team in the construction...3DFull timeContract workWork at officeRemote workMonday to Friday
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- ...world to learn, communicate and advance faster than ever.HBM Core-Die Architecture &... ...development across advanced 3D‑stacked HBM products. This role... ...efficient operation schemes Lead architecture feasibility... ...assistance with the application process and/or for reasonable...3DFull timeLocal areaImmediate start
- ...Position Summary The Director of Member... ...excellence while advancing the council's strategic... ...sustainability Lead, mentor, and... ...programs, systems, and processes Manage organizational... ...to ensure an integrated approach to... ...related field ~2+ year's experience...Flexible hours
- ...a Substation Physical Designer in the Boise area for a remote-to-hybrid role. The position focuses on creating detailed substation drawings... ...proficiency, and the ability to visualize components in 3D without CAD assistance. This role supports hybrid/remote work arrangements...3DRemote jobWork at office
- ...up and manage Revit BIM models, coordinating with discipline leads and producing 3D content and 2D drawings for data center projects. You will... ...deliver constructible, clash-free models. This role offers a hybrid work policy and comprehensive benefits. #J-18808-Ljbffr Jacobs3D
- ..., communicate and advance faster than ever.Within... ...Principal Signal Integrity Engineer at Micron... ...responsible for:Leading the development... ...integrating with package build, silicon develop... ...tools like Q3D, SIWAVE, HFSS, POWERSI... ...with the application process and/or for...3DFull timeLocal areaImmediate start
$66k - $106k
Job Posting Title Business Integration Consultant - Remote Job Description... ...for contributing towards process documentation and best practices... ...experience; HS diploma or GED required 2 years of project management... ...or PBM experience Experience leading cross-functional work efforts...Remote jobWork experience placementLocal areaVisa sponsorshipWork visa
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