Engineering Execution Manager, HIG High Bandwidth Memory (HBM)
Micron Technology, Inc
Req ID: JR99166 Engineering Execution Manager, HIG High Bandwidth Memory (HBM) Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through different phases of a product i.e. concept, build, NPI and HVM by facilitating multi-functional life‑cycle management. You will help build and maintain a detailed development schedule and guide the vital tactical progress. In this position, you will provide leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, identifying, and analyzing issues and risk, and identifying resources to meet timelines and work you’re doing. Responsibilities Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations. Partner with the Technology Development, Build, Process, APTD, PE and Manufacturing teams to drive development progress and alignment. Collaborate with PMO org to build and sustain a detailed development schedule and drive relevant tactical execution starting from pre‑silicon to all the way to HVM. Provide regular communication of development status, priorities, and challenges across the broader organization. Set and prioritize tactical expectations across development activities, according to defined achievements and collaborator needs and expectations. Serve as a point of contact for the product, including identifying owners for tasks and issues that require coverage and leading development documentation. Consolidate and provide the inputs for hardware readiness and prioritisation required to support engineering activities. Minimum Qualifications Bachelor’s or Master’s degree or equivalent experience in Electrical or Computer Engineering or manufacturing/supply chain related fields. 5+ years of relevant technical, manufacturing or experience in driving multi‑functional teams. Excellent Communication/Presentation skills. Excellent written and verbal communication skills for technical and senior management audiences. Preferred Qualifications Comfortable with data analysis methods and data visualization; communicating data‑backed conclusions. Familiarity and capability with JIRA, Confluence, Project Management software tools. Having an innovative outlook which is open to improve upon any process or product. Job Profile(s) Product Development Engineer 4 - Product Development Engineer 5 Relocation Level TBD Benefits As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc. Equal Opportunity Statement Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology, Inc
- ...qualification and quality monitoring of High Bandwidth Memory products (HBM), develop product reliability... ...Collaborate with cross-functional engineering teams to ensure HBM product reliability... ...debugging and data analysis. Execute testing as requested by the project...SuggestedLocal area
- ...all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation... ...advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next‑generation...SuggestedLocal areaWorldwide
$131.56k - $171k
## Engineer - HIG - HBM DesignFolsom, California, United States of America**Our vision is to transform... ...is a world leader in innovating memory and storage solutions that accelerate the... ...reside, the Platform may constitute a high-risk AI system that makes, or is a substantial...SuggestedFull timeWork experience placementLocal areaImmediate start- Req ID: JR96589 Principal Engineer/MTS, HIG-HBM Product System Engineering (Reliability Architect - Media Health Reliability) Responsibilities... ...Experience owning product qualification plans for advanced memory or logic devices Strong data analysis, problem‑solving, and...SuggestedLocal areaRelocation
- 1040 Micron Semiconductor Prds in Boise, Idaho is seeking a New College Grad HBM Technical Customer Manager to support and technically enable High Bandwidth Memory solutions with key customers. In this role, you will grow into a customer-facing technical expert and contribute...Suggested
$112k - $286k
.... Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation... ..., communicate and advance faster than ever. As a HBM Customer Systems Validation Engineer at Micron Technology, Inc., you will: Responsibilities...Full timeLocal areaImmediate start- 1000 Micron Technology, Inc. is seeking a Product Yield Enhancement High Bandwidth Memory Electrical Failure Analysis Engineer to join our team in Boise, Idaho. You will work on next-gen HBM devices, focusing on failure analysis and reliability enhancement. Ideal candidates...
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- Micron Technology, Inc is seeking a Product Yield Enhancement Engineer specializing in High Bandwidth Memory (HBM) for their Boise, Idaho location. This role involves conducting failure analysis of next-gen HBM devices and presenting findings to multiple teams. The ideal...
$120.1k - $251.6k
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- ...support the reliability qualification and monitoring of High Bandwidth Memory (HBM) products. The role involves collaboration with cross-functional... ...candidate will have a Master’s degree in Electrical Engineering or related fields, and experience in debugging and...
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- 1000 Micron Technology, Inc. is seeking a Product Yield Enhancement High Bandwidth Memory Electrical Failure Analysis Engineer in Boise, Idaho. You will focus on failure analysis to enhance product reliability and accelerate time to market. Responsibilities include performing...
- A leading semiconductor company in Boise, Idaho is seeking a talented engineer to develop next-generation High Bandwidth Memory (HBM) products for the automotive market. This role involves working across departments to validate designs and tackle automotive-specific challenges...Part timeRemote work
$115k - $140k
...Chief Executive Officer Boys & Girls Club of the Sequoias seeks a caring, compassionate... ...fun space, engaging Club Experience, and managing caring professionals to guide them along... ...all organizational operations, ensuring high-quality programs, effective systems, and...Remote work- ...President and Chief Executive Officer Full Circle Health (FCH), one of Idaho's most deeply... ...workforce pipelines and cultivate a high performing, values driven culture Ensure... ...Demonstrated expertise in financial management, strategic planning, and organizational...Work experience placementLocal area
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- ...Equipment Development Engineer Our vision is to... ...in innovating memory and storage solutions... ...Own technical execution from roadmap definition... ...through risk management and delivery Partner... ...technologies such as HBM, wafer‑ or die‑... ...equipment development or high‑risk technology...Local areaRelocation
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$167k - $245k
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$39.2k - $72.8k
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