Packaging Engineer

Package Design EngineerTeledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.Teledyne e2v is recruiting a Package Design Engineer, this position can be based at our Saint-Egrève site (near Grenoble, France) or at Teledyne Anafocus in Seville (Spain).Teledyne e2v Semiconductors SAS, based in Saint-Egrève (near Grenoble), has been a recognized semiconductor specialist for more than 70 years. Our 400-employee site brings together research and development teams, production workshops, and support functions for two main business areas:Machine Vision Sensors (MVS) for image sensors, dental sensors, and cameras.High-Performance and High-Reliability semiconductor products: microprocessors, memories and high-speed data converters.Teledyne Anafocus, located in the Seville Tech Park, is a center of excellence in CMOS image sensor and vision-on-chip design, with a highly skilled engineering team and a strong innovation culture. Now fully integrated within Teledyne e2v, the site develops next-generation imaging technologies for industrial, scientific, medical and surveillance applications.The Package Design Engineer leads the complete design flow of advanced microelectronic packages—translating customer needs into technical specifications, defining the solution, and ensuring successful routing and design reviews.As the key technical interface, the Package Design Engineer works closely with packaging vendors and assembly houses throughout the project lifecycle. The role also involves monitoring emerging technologies and leading R&D or continuous-improvement initiatives to shape future generations of imaging packages.Management of the full design flow of organic and ceramic multi-layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP):Identify customers' needs.Devise a solution and a specification.Interact with packaging manufacturers to obtain a solution and a quote all along the design process.Interacting with project teams (sensor designers, project manager…)Implement the design + routing of the package in accordance with the constraints and timing as originally defined.Conduct, electrical, thermal and mechanical simulations when necessary.Conduct DRC checks in accordance with e2v methodologies.Conduct different design reviews including the final one before ordering the package.Assume the role of design expert with respect to assembly houses (assembly instructions…)Ensure technical interface with package vendors and assembly houses:Guide technical reviews with package vendors.Technical Identification and evaluation of new vendors.Technology monitoring :Maintain a technology watch on future generations of imaging packages.Identify and lead R&D or continuous improvement projects on these technologies.A strong customer focused individual (active listening and customers satisfaction), team-worker, with ability to adapt and communicate on subjects requiring rigor.Autonomy to plan for results & continuous improvement are necessary qualities for this positionWhat You Need to be successful in this role:Background in microelectronics, in electronics (preferred), material science or micromechanicsFirst confirmed experience in packaging design.Specific experience in imaging and/or assembly would be a serious plus.Mastering of package design flow: specification, identifying solutions, design, validation.Mastering packaging layout meeting signal/power integrity aspects (under Cadence APD or equivalent).Knowledge basic mechanical design (Solid works or equivalent).Experience in technical management of package vendors and assembly houses.A strong advantage would be:Knowledge in electrical modelisation (parasitic extraction under Cadence Xtract IM, Spice, Ansys).Knowledge in thermal simulations (Ansys workbench, Solid works).An experience in system and sub-system development.A good level of English (B2 minimum) and French both oral and written. Spanish would be a plus.What We Offer:Work on cutting-edge technological projects with high impactJoin an innovation-driven environment in the Grenoble ecosystem, awarded 2026 European Capital of InnovationEvolve within a human-scale site where your contribution truly mattersBuild your career through multiple development paths: technical expertise, project management, and international exposure within the Teledyne group (15,000 employees worldwide)Enjoy a structured onboarding program with a dedicated mentorWork in an attractive and flexible environment: teleworking agreement and real work–life balanceJoin a company deeply committed to QHSE/CSR goals (2025–2030): "40 by 40" carbon plan, Gold-level Pro Vélo certification, support to Handisport and Adapted Sport leaguesBe part of a culture built on respect, integrity, responsibility and citizenshipEvolve in a company committed to gender equality (score: 93/100)Live in a unique Alpine environment, combining technological excellence with excellent quality of life