High-Speed Mixed-Signal Design Engineer

HIGH‑SPEED MIXED SIGNAL DESIGN ENGINEER

Our optical hardware platform requires tightly integrated high‑speed electronic and photonic systems operating at tens of gigahertz and beyond—modulator drivers, trans‑impedance amplifiers, SerDes interfaces, and the analog signal chains that connect them. We are seeking a High‑Speed Mixed‑Signal Design Engineer to architect, design, and validate the high‑speed electronic systems that interface directly with our photonic integrated circuits. You will work across the boundary between electronics and photonics, from transistor‑level circuit design through package and board‑level integration, ensuring the electrical systems meet the bandwidth, linearity, and noise performance our optical links demand.

RESPONSIBILITIES

Design and analyze high‑speed analog and mixed‑signal circuits for electro‑optic systems, including modulator drivers, TIAs, CTLEs, limiting amplifiers, and clock/data recovery circuits Develop and own circuit‑level and system‑level models for high‑speed signal chains, incorporating device parasitics, package effects, and photonic component behavior Perform transistor‑level simulation and verification using industry tools (e.g., Cadence Virtuoso, Spectre, ADS, HFSS) across process corners, temperature, and supply variation Architect high‑speed electrical interfaces between electronic ICs and photonic integrated circuits, defining impedance matching, bandwidth targets, voltage swing, and power constraints Lead or contribute to chip‑to‑package‑to‑board co‑design, including high‑speed interconnect design, SI/PI analysis, and signal integrity closure from die through PCB Collaborate with PIC designers to co‑optimize electro‑optic performance across the driver–modulator and photodetector–TIA interfaces Define characterization and validation strategies for high‑speed electronic and electro‑optic subsystems, including S‑parameter measurements, eye diagram analysis, and BER testing Analyze measurement data and correlate to simulation models, driving root‑cause investigation and design iteration Partner with manufacturing and test engineering teams to develop production test methods for high‑speed electrical and electro‑optic assemblies Contribute to component selection, evaluation, and qualification for high‑speed electronic devices (e.g., driver ICs, TIAs, CDRs, PLLs)

QUALIFICATIONS

Master's or PhD in electrical engineering, applied physics, or a related discipline 3+ years of experience in high‑speed analog, mixed‑signal, or RF circuit design, with emphasis on circuits operating at multi‑GHz bandwidths Strong foundation in analog and RF circuit design principles, including small‑signal and large‑signal analysis, noise analysis, and stability Experience with circuit simulation tools (e.g., Cadence Spectre, ADS, HFSS, or equivalent) Understanding of high‑speed serial link architectures and signaling formats (e.g., NRZ, PAM4, coherent modulation) Experience with high‑speed lab characterization, including use of high‑bandwidth oscilloscopes, VNAs, BERTs, and spectrum analyzers Working knowledge of semiconductor device physics and IC fabrication processes (CMOS, SiGe BiCMOS, or III‑V) Strong programming and data analysis skills (e.g., Python, MATLAB) for simulation automation, data processing, and visualization Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

Experience designing high‑speed circuits for optical communications, including modulator drivers, TIAs, or SerDes front‑ends ASIC or custom IC design experience, including full design flow from specification through tapeout and silicon validation Experience with high‑speed package and interconnect design, including wirebond, flip‑chip, or co‑packaged optics integration Deep expertise in one or more of: wideband amplifier design (>25 GHz), high‑speed DAC/ADC interfaces, PLL/CDR design, or RF power amplifier design Familiarity with DSP concepts relevant to optical links (e.g., FFE, DFE, CTLE equalization) and optical performance metrics (e.g., OSNR, OMA, receiver sensitivity) Experience with electromagnetic simulation for high‑speed interconnects and packaging (e.g., HFSS, Momentum, CST) Experience with photonic‑electronic co‑design or co‑simulation (e.g., Lumerical Interconnect, VPI, ADS co‑simulation) Experience working with silicon photonics or III‑V electro‑optic platforms Familiarity with reliability and qualification testing for high‑speed electronic or electro‑optic assemblies

COMPENSATION AND BENEFITS

Pay range: High‑Speed Mixed Signals Design Engineer: $140,000.00 - $190,000.00/per year Title and base salary are determined on a case by case basis commensurate with experience and merit. In addition to base salary, compensation for this role includes: Eligibility for long‑term incentives including company stock options and discretionary bonuses awarded for exceptional achievements. Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents. Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year). 401(k) retirement plan access. Relocation assistance to sunny Los Angeles. #J-18808-Ljbffr Meshopticaltechnologies