Aspiring ASIC Package Engineer Co-op 2027
AMD
AMD is seeking a highly motivated ASIC Package Engineering intern/co‑op. You will join a team bringing advanced packaging technology to reality, involved in substrate, interposer, and bump design for AMD products. You will learn design verification, yield analysis, and benchmarking packaging materials, working with partners to meet performance and cost targets. This internship offers real-world experience across multiple packaging domains. #J-18808-Ljbffr AMD
Vacancy posted 1 day ago
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