Director, Yield Architecture & Engineering San Diego, California, United States of America ASICS Eng

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: We are seeking an engineering leader with strong software, automation, governance, and team-building experience to serve as Director, Automation within the Yield Management team in Process Packaging Solutions. This role will lead the next phase of automation for yield engineering by building the systems, workflows, dashboards, and AI-enabled tools that make the team’s work more predictable, visible, and repeatable. A central part of this role is to institutionalize how the team operates. The leader will automate governance processes and create operating rhythms that make project plans, reviews, decisions, lessons learned, CAPA, dashboards, and status reporting easier to run and sustain. The leader will ensure every major initiative has a clear why, what, who, and when; every review closes with owners and dates; and lessons learned feed back into repeatable workflows. The role will also build a more connected team culture by creating shared standards, common tools, and operating rhythms that help distributed engineers work from shared expectations and a common operating model. Key Responsibilities: Governance Automation and Operating Discipline: Build and automate the team’s core governance processes, including project planning, intake, prioritization, roadmap tracking, operating reviews, lessons learned, CAPA tracking, decision logs, dashboards, KPIs, and status reporting. Ensure each major initiative clearly defines why the work matters, what will be delivered, who owns it, and when it will be completed. Capture lessons learned and CAPA outcomes as institutional memory, not one-off knowledge. Automation Strategy and Roadmap: Define and execute the automation roadmap for yield management, diagnostics, analytics, engineering operations, and reporting. Prioritize work based on business impact, engineering time saved, quality improvement, risk reduction, and readiness for new technology programs such as advanced packaging, 3DIC, and large compute products. Software, Data, and AI Systems: Lead the development of robust automation frameworks, data pipelines, dashboards, engineering applications, and AI-enabled decision-support systems. Evolve workflows from traditional scripts to scalable platforms, then to AI-augmented systems that improve signal detection, root-cause analysis, reporting, and corrective-action speed. Team Building and Culture: Build a connected, collaborative automation function across sites and disciplines. Create shared standards, operating rhythms, and team practices that reduce silos, strengthen collaboration, and help engineers work together from a common operating model. Cross-Functional Workflow Integration: Partner with yield, diagnostics, design, DFT, product and test engineering, failure analysis, process technology, IT, EDA vendors, and manufacturing stakeholders to connect data, tools, and decisions across the silicon lifecycle. Translate expert workflows into repeatable systems without taking ownership away from domain experts. Technical Team Leadership: Lead, coach, and develop a distributed automation team. Build talent depth in software engineering, data engineering, AI, infrastructure, and semiconductor workflow automation. Reduce single points of failure through documentation, code quality, reusable platforms, cross-training, and succession planning. Continuous Improvement and Capacity Creation: Drive a continuous-improvement mindset that uses automation to reduce manual effort, improve quality, and free senior engineering capacity for higher-value priorities. Treat efficiency gains as capacity to redeploy toward strategic work, not simply as cost reduction. Minimum Qualifications: Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience. Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience. PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience. Preferred Qualifications: Automation Leadership: Proven experience building or scaling automation platforms, engineering applications, data pipelines, dashboards, or AI-enabled workflows that improve engineering productivity, quality, and decision speed. Software and Data Depth: Strong technical foundation in Python or similar languages, database systems, distributed compute, APIs, CI/CD, data modeling, visualization, and maintainable software practices in complex engineering environments. AI-Enabled Engineering Systems: Experience applying machine learning, LLMs, or AI-enabled workflows to engineering productivity, anomaly detection, diagnostics, reporting, or decision support, with practical judgment about where AI helps and where conventional automation is the better answer. Semiconductor Workflow Understanding: Familiarity with semiconductor yield, diagnostics, test, EDA tools, manufacturing data, product engineering, or hardware debug workflows, with the ability to translate domain-expert processes into scalable automation. People Leadership and Operating Discipline: Experience building teams across sites or functions, especially where shared process, communication, and operating discipline are important to scale execution. Demonstrated ability to establish project planning, operating reviews, lessons learned, CAPA tracking, roadmap management, and continuous improvement practices. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail View email address on click.appcast.io or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $216,400.00 - $324,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link. #J-18808-Ljbffr Qualcomm