Staff / Principal Advanced Packaging Engineer

Bitdeer is a world-leading technology company for Bitcoin mining and AI cloud.

We are seeking a Staff / Principal Advanced Packaging Engineer to lead packaging architecture, technology strategy, and high-volume manufacturing execution for next-generation HPC silicon.

This is a high-impact, hands-on technical leadership role responsible for driving advanced packaging from concept through mass production. You will define the company’s packaging roadmap, lead cross-functional chip-package-board co-design, and ensure scalable, reliable production for large-die, high-power devices.

• Serve as the company's technical authority on advanced semiconductor packaging.
• Define packaging architecture and select optimal technologies for high-performance semiconductor products and advanced computing applications.
• Evaluate and optimize PPAC (Performance, Power, Area, Cost) trade-offs across advanced packaging solutions such as high-layer-count FCBGA, packaging architectures, and other advanced package technologies.
• Lead system-level Chip–Package–Board co-design in close collaboration with silicon and hardware teams.

• Lead technical engagement with internal stakeholders, external packaging design houses, and substrate suppliers.
• Establish design rules, review processes, project schedules, and quality standards for package development.
• Perform technical reviews and sign-off for substrate layouts, DRC/DFM compliance, and critical design milestones.
• Collaborate with suppliers to assess process capabilities, manufacturability, and technology roadmaps while mitigating technical and schedule risks.

• Lead package-level Signal Integrity (SI) and Power Integrity (PI) reviews for high-speed interfaces such as PCIe, SerDes, DDR/HBM memory interfaces, and other advanced interconnect technologies.
• Review and validate electromagnetic simulation results to ensure compliance with electrical performance targets.
• Drive thermal architecture and mechanical reliability strategies for advanced semiconductor packages.
• Oversee warpage, stress, thermal, and reliability modelling (e.g. Ansys, Flotherm) to minimize packaging risks and ensure long-term product reliability.

• Lead packaging execution through New Product Introduction (NPI) into high-volume manufacturing.
• Resolve technical issues throughout the packaging process, including bumping, assembly, molding, and package integration.
• Drive root cause analysis and resolution of manufacturing challenges, including yield improvement, solder defects, bonding issues, and reliability concerns.
• Define reliability qualification strategies and lead failure analysis (FA) using industry-standard methodologies.

• Bachelor's degree or above in Microelectronics, Semiconductor Engineering, Electronic & Electrical Engineering, or a related discipline.
• 8+ years of experience in advanced semiconductor packaging, package architecture, design, or process engineering.
• Proven experience bringing complex semiconductor products (e.g. SoC, ASIC, networking, storage, or high-performance computing devices) from concept through high-volume production.
• Strong hands-on experience with high-layer-count FCBGA; experience with packaging technologies is highly preferred.
• Expert-level substrate layout review capability using Cadence APD, Allegro, or equivalent tools.
• Deep knowledge of SI/PI analysis for high-performance semiconductor devices and high-speed interfaces.
• Good understanding of thermal and mechanical challenges in advanced packaging, including warpage mitigation and stress management.
• Familiarity with JEDEC reliability standards and failure analysis techniques such as SAT, X-ray, FIB, and SEM.
• Excellent communication and cross-functional collaboration skills.
• Proven ability to manage and influence external vendors through technical leadership.
• Self-driven, accountable, and capable of leading complex packaging programs independently from development through production.

• A culture that values authenticity and diversity of thoughts and backgrounds;
• An inclusive and respectable environment with open workspaces and exciting start-up spirit;
• Fast-growing company with the chance to network with industrial pioneers and enthusiasts;
• Ability to contribute directly and make an impact on the future of the digital asset industry;
• Involvement in new projects, developing processes/systems;
• Personal accountability, autonomy, fast growth, and learning opportunities;
• Attractive welfare benefits and developmental opportunities such as training and mentoring.