Senior RFIC/MMIC Design Engineer

What if you could design RF hardware without treating the chip, package and materials stack as separate problems? I’m working with a well-funded, MIT-rooted semiconductor startup developing a new multi-material 3D integration platform for next-generation high-frequency systems. A few things that make it stand out: Significant early-stage funding and ambitious growth plans Technology rooted in advanced 3D heterogeneous integration Early technical hires will have broad ownership across chip, package and system-level decisions What you’ll work on: RFIC/MMIC design across microwave and mmWave Active RF blocks including PAs, LNAs and beamforming-related circuits Architecture through tapeout, validation and hardware debug What they’re looking for: Multiple delivered chips or significant RF hardware programs Experience with demanding high-frequency systems and measured hardware Advanced RF | Heterogeneous integration | Early-team ownership | Equity #J-18808-Ljbffr